Wafer heating apparatus, electrostatic chuck, and method for manufacturing wafer heating apparatus
A heating device and wafer technology, which is applied in the manufacture of semiconductor/solid-state devices, circuits, electrical components, etc., can solve the problems of not being able to achieve heat uniformity, the amount of filler added is limited, and improved, and achieves uniform heat distribution and reduction of heat. Small deviation, uniform heat diffusion effect
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[0070] Embodiments of the wafer heating apparatus of the present invention will be described below.
[0071] Made as follows figure 1 , figure 2 A wafer heating device 1 of the structure shown.
[0072] First, as the base member 3, a circle made of an aluminum alloy composed of an Al-Mg-Si alloy (aluminum alloy standard number 6061 (JIS H 4000, etc.)) and in which a cooling passage through which a cooling medium such as water can flow is formed. Plate-shaped base member. The size of the base member 3 is 300 mm in diameter and 35 mm in thickness. In addition, the base member 3 is provided with a terminal hole for supplying electricity to the heating electrode 17 after bonding the insulating layer 5 in which the heating electrode 17 is embedded.
[0073] Next, the heating electrode 17 is made of inconel (trade name (Ni-Cr-Fe alloy)), and is formed into a predetermined pattern by etching or the like. The disc-shaped insulating layer 5 in which the heater electrode 17 is bur...
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