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Method for predicting dynamic recrystallization microstructure evolution in thermal deformation process of pure copper

A technology of recrystallization structure and prediction method, applied in the field of metal rolling, can solve the problems of no specific parameters, low reliability, lack of physical meaning of selected parameters, etc., and achieve the effect of saving experimental cost and optimizing structure and performance.

Inactive Publication Date: 2011-11-09
TIANJIN UNIV
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Problems solved by technology

[0004] Relevant patent reports (authorization number 101591729B), according to the prediction of the recrystallization structure evolution of strip steel according to the cellular automata method, the constructed model is simple, the selected parameters lack certain physical meaning, the embodiment has no specific parameters, and the reliability is not high. high

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  • Method for predicting dynamic recrystallization microstructure evolution in thermal deformation process of pure copper
  • Method for predicting dynamic recrystallization microstructure evolution in thermal deformation process of pure copper
  • Method for predicting dynamic recrystallization microstructure evolution in thermal deformation process of pure copper

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Embodiment 1

[0037] Divide the simulation area of ​​the model of formula (1) into a two-dimensional space of 1045×1101, and the entire simulation area represents a sample size of 0.5225mm×0.5505mm. Select parameter interface energy γ=0.208J / m 2 , M 0 =0.139m 4 K / Js, μ=42.1GPa, activation energy Qa=275KJ / mol, activation energy Q b =110KJ / mol, c=5.0×10 25 , d=1, temperature T=800k, strain rate Then, the regular regular hexagonal initial parent phase matrix grain structure with an average radius of 13.56 μm was calculated by the program. The initial dislocation density ρ is given for each grain ini =1.0×10 9 / m 2 , use an array P to store the phase field value of each grain, and use another array Q to store the number of each grain. After the initial state is given, stress and deformation are applied, the total number of calculation steps is 19200, and the change of dislocation density is calculated by formula (3). When the dislocation density reaches the critical value ρ c =5.5×10 ...

Embodiment 2

[0039]Divide the simulation area of ​​the model of formula (1) into a two-dimensional space of 913×769, and the entire simulation area represents a sample size of 0.4565mm×0.3845mm. Select parameter interface energy γ=0.208J / m 2 , M 0 =0.139m 4 K / Js, μ=42.1GPa, activation energy Qa=275KJ / mol, activation energy Q b =110KJ / mol, c=5.0×10 25 , d=1, strain rate The deformation temperatures are respectively selected as 750K, 800K, 850K and 950K. Then, the regular regular hexagonal initial parent phase matrix grain structure with an average radius of 116.62 μm was calculated by the program. The initial dislocation density ρ is given for each grain ini =1.0×10 9 / m 2 , use an array P to store the phase field value of each grain, and use another array Q to store the number of each grain. After the initial state is given, stress and deformation are applied, the total number of calculation steps is 19200, and the change of dislocation density is calculated by formula (3). When ...

Embodiment 3

[0041] Divide the simulation area of ​​the model of formula (1) into 913×769, 1065×1025, 1065×897 and 1045×1101 two-dimensional space respectively, and the whole simulation area represents 0.4565mm×0.3845mm, 0.5325×0.5125mm, 0.5325mm× 0.4485mm and 0.5225mm×0.5505mm sample size. Select parameter interface energy γ=0.208J / m 2 , M 0 =0.139m 4 K / Js, μ=42.1GPa, activation energy Qa=275KJ / mol, activation energy Q b =110KJ / mol, c=5.0×10 25 , d=1, strain rate Temperature T=800K. Then the regular regular hexagonal initial parent phase matrix grain structure with average radii of 13.56 μm, 37.76 μm, 67.34 μm and 116.62 μm was calculated by the program. The initial dislocation density ρ is given for each grain ini =1.0×10 9 / m 2 , use an array P to store the phase field value of each grain, and use another array Q to store the number of each grain. After the initial state is given, stress and deformation are applied, the total number of calculation steps is 19200, and the chan...

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Abstract

The invention discloses a method for predicting dynamic recrystallization microstructure evolution in the thermal deformation process of pure copper. In the method, a multi-phase field and dislocation density coupled numerical model is constructed, and related parameters are input, so that the dynamic recrystallization microstructure evolution process, the change of flow stress, dynamic recrystallization conversion fraction and the change condition of average grain size are predicted in real time, the development cost is greatly saved and the development period of new products is shortened. By the method for predicting the dynamic recrystallization microstructure evolution in the thermal deformation process of pure copper, the grain structure in the thermal deformation process is observed in real time, a change rule of a stress strain curve, a kinetic conversion rule of dynamic recrystallization and the conversion form of the grain size along with strain change are obtained, and the method has important significance for reasonably making a processing technology and optimizing the structure and performance of a product.

Description

technical field [0001] The invention relates to a method for predicting the dynamic recrystallization structure evolution in the hot deformation process of pure copper, and belongs to the technical field of metal rolling. Background technique [0002] There is a complex microstructure evolution process in the hot rolling process of metal materials, often accompanied by dynamic recovery and dynamic recrystallization process. During multi-stage rolling, a static recovery phenomenon occurs that has a significant impact on the final grain size. [0003] At present, the research on the hot rolling process of metal materials mainly relies on experimental methods, which not only consumes a lot of manpower, material resources, and financial resources, but also cannot observe the change process of the structure in real time. With the rapid development of computer technology, numerical simulation has become an important method in material research. By establishing an appropriate phys...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C21D11/00C21D8/00
Inventor 师春生徐树杰张坤宇刘恩佐何春年赵乃勤
Owner TIANJIN UNIV
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