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Sticker for dustproof film assembly

A technology of dust-proof film components and dust-proof films, which is applied in the direction of film/sheet-shaped adhesives, adhesives, and originals for photomechanical processing, to achieve the effect of suppressing false detection and preventing the decline in yield

Active Publication Date: 2011-11-09
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The present invention has been made in view of the above circumstances. The object of the present invention is to select an adhesive that does not generate stray light due to reflection and refraction in the adhesive when detecting foreign objects in the pellicle. resulting in the problem of false detection

Method used

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  • Sticker for dustproof film assembly
  • Sticker for dustproof film assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] First, fabricate the pellicle frame. The outer dimensions are 782×474mm, the inner dimensions are 768×456mm, and the height is 5.0mm. , the width of the flat surface of the two ends of the frame is 4.0mm, the inner radius of the corner is 2.0mm, and the outer radius is an aluminum alloy dustproof film assembly frame of 6.0mm, and its surface is treated with black aluminum oxide film .

[0033] The pellicle frame was carried into a clean room, thoroughly washed with a neutral detergent and pure water, and dried.

[0034] As an adhesive with a total light transmittance of 70% or less, fumed silica (fumed silica) Musil was added to 100 parts by mass of silicon adhesive X-40-3122 (manufactured by Shin-Etsu Chemical Co., Ltd., trade name). -120A (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) was mixed and prepared. Thereafter, the prepared adhesive was applied to the lower end surface of the pellicle frame.

[0035] Then, the adhesive was air-dried until it st...

Embodiment 2

[0038] In addition to 100 parts by mass of silicon adhesive X-40-3122 (manufactured by Shin-Etsu Chemical Co., Ltd., trade name), 0.3 parts by mass of black carbon paste (カ一ボンペースト) K-LIMS color-02 (Shin-Etsu Chemical Kogyo Co., Ltd., trade name), except for mixing and preparing, the production of the pellicle was carried out in the same manner as in Example 1.

Embodiment 3

[0040] In addition to adding 3 parts by mass of black iron oxide paste (ペ一スト) K-color-FE035 (Shin-Etsu Chemical Co., Ltd. Co., Ltd., trade name), except for mixing and preparing, the production of the pellicle was carried out in the same manner as in Example 1.

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PUM

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Abstract

The invention provides a sticker, with which no false detection due to stray light generated by the reflection or refraction of light on the sticker will occur at the time of foreign matter detection of a dustproof film assembly. The dustproof film assembly is composed by at least a dustproof film and a dustproof film assembly frame. One end face of the dustproof film assembly frame is attached with the dustproof film. The other end face of the dustproof film assembly frame is provided with the sticker used for attaching the dustproof film assembly to a glass substrate. The upper surface of the sticker is provided with a peelable piece. The integral light transmissivity of the sticker is no more than 70%. The sticker of the dustproof film assembly is preferably black.

Description

technical field [0001] The present invention relates to a method of manufacturing a pellicle for lithography used as a dust remover for a mask for lithography when manufacturing semiconductor devices, printed circuit boards, liquid crystal displays, etc., and particularly relates to adhesion of pellicle frames agent. Background technique [0002] In the manufacture of LSI (Large Scale Integration), Super LSI (Very Large Scale Integration), or liquid crystal displays, semiconductor wafers and original plates for liquid crystals are irradiated with light to form patterns. If foreign matter adheres to the photomask or intermediate photomask (collectively referred to as photomask in this specification) used at this time, not only the edge of the pattern transferred on the semiconductor wafer or the original plate for liquid crystal will not be clear, but also It can also cause background smudges and compromise size, quality and appearance. [0003] Thus, exposure of semiconduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/14C09J7/02G03F1/64
CPCC09J7/02G03F1/14G03F1/64C09J7/20C09J9/00C09J201/00G03F1/62
Inventor 堀越淳
Owner SHIN ETSU CHEM IND CO LTD
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