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Fluid handling structure, lithographic apparatus and device manufacturing method

A technology for fluid processing and lithography equipment, used in semiconductor/solid-state device manufacturing, microlithography exposure equipment, optomechanical equipment, etc.

Active Publication Date: 2015-01-21
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While such systems improve substrate temperature control and handling, evaporation of the immersion liquid can still occur

Method used

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  • Fluid handling structure, lithographic apparatus and device manufacturing method
  • Fluid handling structure, lithographic apparatus and device manufacturing method
  • Fluid handling structure, lithographic apparatus and device manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically shown. The lithography equipment includes:

[0040] - an illumination system (illuminator) IL configured to condition a radiation beam B (eg, ultraviolet (UV) radiation or deep ultraviolet (DUV) radiation);

[0041] - a support structure (eg mask table) MT configured to support the patterning device (eg mask) MA and connected to first positioning means PM configured to precisely position the patterning device MA according to determined parameters;

[0042] - a substrate table (e.g. a wafer table) WT configured to hold a substrate (e.g. a resist-coated wafer) W and configured for a second positioning of the substrate W precisely according to determined parameters device PW connected; and

[0043] - A projection system (eg a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the patterning device MA onto a target portion ...

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PUM

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Abstract

A fluid handling structure (12) for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space (11) configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings (50) arranged in a first line that, in use, are directed towards a substrate (W) and / or a substrate table (WT) configured to support the substrate; a gas knife device (60) having an elongate aperture (61) in a second line; and an elongate opening or a plurality of openings (302) adjacent the gas knife device.

Description

technical field [0001] The present invention relates to a fluid handling structure, a lithographic apparatus and a method of fabricating a device. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred by imaging the pattern onto a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of adjacent target portions that are successively patterned. Known lithograp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70341G03F7/2041H01L21/0274
Inventor R·H·M·考蒂P·M·M·里布莱格特斯M·瑞鹏F·伊凡吉里斯塔
Owner ASML NETHERLANDS BV