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Slotting device for abrasive freezing and solidifying polishing pad

A technology of consolidating abrasives and polishing pads, which is applied in the direction of grinding devices, grinding/polishing equipment, abrasives, etc., can solve the problems of uneven distribution of polishing stress, unsatisfactory polishing effect, and low removal rate of polishing pads. Optimal polishing stress distribution, high cost performance and simple structure

Inactive Publication Date: 2013-01-30
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to design a kind of slotting device capable of slotting the frozen fixed abrasive polishing pad for the shortcomings of the non-grooved frozen fixed abrasive polishing pad, such as low removal rate, uneven distribution of polishing stress, and unsatisfactory polishing effect. Slot device

Method used

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  • Slotting device for abrasive freezing and solidifying polishing pad
  • Slotting device for abrasive freezing and solidifying polishing pad
  • Slotting device for abrasive freezing and solidifying polishing pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Such as Figure 1-6 shown.

[0045] A grooving device for a frozen solidified abrasive polishing pad, which mainly consists of the following components:

[0046] A slotting mold 1, the side of the slotting mold 1 opposite to the frozen solidified abrasive polishing pad 2 is provided with matching raised ribs 3, and the center of the slotting mold 1 is provided with a support column 4 (length Generally between 65mm and 100mm); the structural diagram of the slotting die 1 is as follows Figure 1-3 As shown, it can also be designed into other shapes according to the needs during specific implementation. The material of the slotting mold 1 can be LY12, 6061 alloy aluminum and other materials with good thermal conductivity and high hardness. In order to increase the strength, a circle of reinforcement ring 18 is set on the outer ring ; figure 1 The protruding ribs 3 are radial, figure 2 The raised ribs are grid-shaped, image 3 The raised ribs 3 are in a helical st...

Embodiment 2

[0054] Such as Figure 1-3 , 5-9 shown.

[0055] A grooving device for a frozen solidified abrasive polishing pad, which mainly consists of the following components:

[0056] A slotting mold 1, the side of the slotting mold 1 opposite to the frozen solidified abrasive polishing pad 2 is provided with matching raised ribs 3, and the center of the slotting mold 1 is provided with a support column 4 (length Generally between 65mm and 100mm); the structural diagram of the slotting die 1 is as follows Figure 1-3 As shown, it can also be designed into other shapes according to actual needs. The material of the slotting mold 1 can be LY12, 6061 alloy aluminum and other materials with good thermal conductivity and high hardness. In order to increase the strength, it is best to set a ring on the outer ring to strengthen Circle 18; figure 1 The protruding ribs 3 are radial, figure 2 The raised ribs are grid-shaped, image 3 The raised ribs 3 are in a helical structure;

[00...

Embodiment 3

[0064] Such as Figure 1-3 , 10 shown.

[0065] A grooving device for a frozen solidified abrasive polishing pad, which mainly consists of the following components:

[0066] A slotting mold 1, the side of the slotting mold 1 opposite to the frozen solidified abrasive polishing pad 2 is provided with matching raised ribs 3, and the center of the slotting mold 1 is provided with a support column 4 (length Generally between 65mm and 100mm); the structural diagram of the slotting die 1 is as follows Figure 1-3 As shown, it can also be designed into other shapes according to the needs during specific implementation. The material of the slotting mold 1 can be LY12, 6061 alloy aluminum and other materials with good thermal conductivity and high hardness. In order to increase the strength, a circle of reinforcement ring 18 is set on the outer ring ; figure 1 The protruding ribs 3 are radial, figure 2 The raised ribs are grid-shaped, image 3 The raised ribs 3 are in a helic...

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Abstract

The invention discloses a slotting device for an abrasive freezing and solidifying polishing pad. The slotting device comprises a slotting mould (1), a heating platform (5), a bearing device (8), and a lifting device (9); one surface of the slotting mould (1) opposite to the abrasive freezing and solidifying polishing pad (2) is provided with protruded ribs (3) which are matched with each other; the center of the slotting mould (3) is provided with a support column (4); the heating platform (5) is directly contacted with the lower end of the supporting column (4) on the slotting mould (1); a heat insulation pad (6) is placed on the heating platform (5); a water receiving disc (7) is placed on the heat insulation pad (6); the abrasive freezing and solidifying polishing pad (2) is positioned in the bearing device (8); and the lifting device (9) drives the bearing device (8) to move up and down through a connection piece (10) or directly drives the bearing piece (8) to move up and down. The slotting device has a simple structure and is easy to implement.

Description

technical field [0001] The invention relates to a mechanical processing device, in particular to a secondary processing device for a frozen solidified abrasive polishing pad, in particular to a slotting device for a frozen solidified abrasive polishing pad. Background technique [0002] At present, with the development of Ultra Large Scale Integrated Circuits (ULSI), the integration level of chips is getting higher and higher, the diameter of the silicon wafer as one of the base materials is increasing and the width of the silicon wafer is becoming thinner and thinner. This requires that the surface of the wafer not only have nanometer-level surface precision and sub-nanometer surface roughness, but also ensure that its surface is free from damage. CMP technology is currently an irreplaceable interlayer planarization method in the multilayer wiring of ULSI chips, and it is also the most effective method for silicon wafer processing to finally obtain nano-scale ultra-smooth a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D13/00B24D18/00
Inventor 左敦稳孙玉利杨张一祝晓亮张国家曹连静史晨红
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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