Semiconductor refrigeration high-power LED lamp

Abstract

The invention discloses a semiconductor refrigeration high-power LED lamp, aiming at solving the junction temperature problem of a high-power LED lamp. The technical scheme adopted by the invention is as follows: a cold end of a semiconductor refrigeration sheet is connected with a module baseplate of a high-power LED module via a cold end metal sheet; a temperature sensor is mounted on or near the module baseplate, the temperature sensor is in electric connection with an upper-lower limit temperature control circuit, a temperature control switch in electric connection with the semiconductor refrigeration sheet is in electric connection with the upper-lower limit temperature control circuit, and a power supply is connected with the temperature control switch, the upper-lower limit temperature control circuit and the high-power LED module through a power supply switch respectively; the module baseplate, the cold end metal sheet and a radiator are connected together by a plurality of heat insulation bolts; and heat insulation materials are filled on the periphery of the semiconductor refrigeration sheet and between the radiator and the cold end metal sheet. According to the semiconductor refrigeration high-power LED lamp, the semiconductor refrigeration sheet is used for cooling actively and forcibly; the working temperature of the high-power LED module is reduced to below 40 degrees centigrade; and the luminous efficiency of the high-power LED is enhanced to the greatest limit.

Description

technical field [0001] The invention relates to an LED lamp, in particular to a semiconductor refrigeration high-power LED lamp, which belongs to the lighting field. Background technique [0002] As an excellent semiconductor light source, LED (Light Emitting Diode) is expected to become an ideal new-generation solid-state energy-saving lighting source in the next 10 years due to its small size, low power consumption, long service life, and environmental protection. However, in the process of developing to high-power LED lighting, it is affected by the heat dissipation problem, which has become the main bottleneck hindering the popularization and application of high-power LED technology. Since the luminous characteristics of the LED determine that its operating temperature is inversely proportional to the luminous efficiency, the rise of the LED junction temperature will reduce the luminous efficiency of the high-power LED, accelerate the light decay of the LED, and signific...

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Problems solved by technology

However, the problem with this structure is: on the one hand, because the cold end and the hot end of the semiconductor cooling sheet in this scheme are respectively connected to the back of the LED light source and the radiator through organic silica gel, the combination is often not strong for high-power LED lights. , and once the organic silica gel cracks, it will directly lead to the scrapping of the product; There is a "heat conduction short circuit" that does not pass through the semiconductor refrigeration sheet, and the temperature rise of the radiator caused by the "heat conduction short circuit" is not generated by the semiconductor refrigeration sheet, that is to say, the forced cooling performance of the semiconductor refrigeration sheet is not fully utilized. Therefore, it is very difficult to further keep the LED working in a lower temperature environment

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