Formwork with frame, its manufacturing method and application

Abstract

The present invention provides a board having frames, the board comprising a substrate and a plurality of frames located on one side of the substrate. The frames are formed by a lithography process. The thickness of the frames is in the range of 75 &mgr; m to 500 &mgr; m, and the width of the frames is the range of 50 &mgr; m to 500 &mgr; m. The present invention further provides a method of manufacturing the board and applications for the board. A highly integrated design for light-emitting elements can be easily achieved by the present invention, thereby providing a higher luminous power. In addition, the present invention provides a simpler manufacturing method which can reduce manufacturing cost and increase competitiveness in industry. Furthermore, the present invention is applicable to light-emitting elements with a film having uniform thickness and thinning design, and enables flexible illumination assembly to be easily achieved.

Description

technical field [0001] The invention relates to a template with a frame and its manufacturing method, especially a template capable of improving the luminous power of a light-emitting component, its manufacturing method and the manufactured luminous component. Background technique [0002] Light-emitting components, especially light-emitting diodes (LEDs), are solid-state semiconductor materials that are less susceptible to damage than traditional cold-cathode fluorescent lamps (CCFLs), and they do not contain mercury, so there is no environmental problem of mercury pollution. In addition, light-emitting diodes The components also have the characteristics of power saving, light weight and long service life. Furthermore, the LED assembly has the technical feature of being able to use a local control switch, so it can show better contrast between light and dark, and the LED assembly has a wider color saturation (color saturation), and the LED assembly can Faster switching on ...

AI Technical Summary

Problems solved by technology

[0003] The design of the traditional light emitting diode component on the light source is that a single chip is independently formed into a light emitting diode light source, but this design cannot meet the needs of high luminous efficiency for light and thin displays or indoor lighting. In order to solve For the above problems, one of the existing technologies solves the problem of insufficient luminous efficiency by improving the light-emitting efficiency of the light-emitting diode chip, but this method will lead to the problem of light emission and the concentration of heat sources at the same time.

[0004] Therefore, the design method of multiple light emitting diode chips on a single substrate is a solution that can meet the requirements of thinning and improving luminous efficiency at the same time. In the prior art, the bonding processing method of thermoplastic resin is used as the frame of the light emitting diode component. However, this method cannot meet the high-resolution requirements of high-density light-emitting diode chips. In addition, the frame made of the above-mentioned lamination process of thermoplastic resin has the problems of uneven film thickness and poor flatness, and The slower speed of the process also increases the production cost

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