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Cyanide-free silver plating solution containing auxiliary complexing agent

An auxiliary complexing agent and cyanide-free silver plating technology, which is applied in the field of electrochemical silver plating, can solve the problems of rough and dull plating, interference of electroplating silver, and little research on anode passivation inhibition, so as to achieve bright plating adhesion and good anode Passivation suppression, good coating bonding effect

Inactive Publication Date: 2011-12-14
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it can be seen from the current research status that the current efforts of cyanide-free silver plating are mainly focused on finding better complexing agents and additives, especially those substances that have a great impact on the cathode process, and have a negative effect on the anode passivation during the electrodeposition process. There is little research on chemicalization and its inhibition
The anode passivation will greatly interfere with electroplating silver, especially for long-term continuous operation, the anode passivation will cause the coating to be rough and dull

Method used

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  • Cyanide-free silver plating solution containing auxiliary complexing agent
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  • Cyanide-free silver plating solution containing auxiliary complexing agent

Examples

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Embodiment 1

[0020] A cyanide-free silver plating solution containing auxiliary complexing agent, which is composed of silver ion source, complexing agent, auxiliary complexing agent, supporting electrolyte, electroplating additive and pH adjuster, etc. The specific material composition and concentration are shown in the table 1 shown. The configuration method is as follows: control the temperature to 50°C, mix the complexing agent, supporting electrolyte and pH adjuster evenly, then slowly add the source of silver ions, stir until the solution is clear, and then add auxiliary complexing agent to make cyanide-free silver plating. electroplating solution, and finally add electroplating additives to it, stir evenly, and let it stand for use. The pH value of the plating solution ranges from 8 to 12. During the plating process, the plating solution is maintained at 50 to 60 °C. Then, the pretreated metal substrate was connected to the circuit and immersed in the electroplating solution with a...

Embodiment 2

[0025] The substances in the cyanide-free silver-plating electroplating solution containing the auxiliary complexing agent are shown in Table 2, and the preparation method is the same as that in Example 1. The current density of the electroplating is 1.0A / dm 2 , the plating time is 2min.

[0026] Table 2 The composition of each substance in the cyanide-free silver plating solution containing auxiliary complexing agent

[0027] component specific substance concentration silver ion source AgCl 40g / L complexing agent Succinimide 170g / L auxiliary complexing agent EDTA 20g / L Supporting Electrolytes K 2 CO 3 15g / L pH adjuster KOH 10g / L Plating Additives Selenite 200mg / L Plating Additives Potassium Antimony Tartrate 50mg / L

[0028] like figure 2 Shown is a silver-plated sample of copper sheet electroplated with the above bright cyanide-free silver-plating electroplating solution.

Embodiment 3

[0030] The material composition of the cyanide-free silver-plating electroplating solution containing the auxiliary complexing agent is shown in Table 3, and the preparation method and the test method are the same as those in Example 2.

[0031] Table 3 The composition of each substance in the cyanide-free silver plating solution containing auxiliary complexing agent

[0032] component specific substance concentration silver ion source AgNO 3 30g / L complexing agent Hein 140g / L auxiliary complexing agent HEDP 10g / L Supporting Electrolytes K 2 CO 3 20g / L pH adjuster NaOH 15g / L Plating Additives L-Histidine 200mg / L Plating Additives vanillin 300mg / L

[0033] like image 3 As shown, it is a picture of a prepared LED lead frame electroplated with the above bright cyanide-free silver plating solution.

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Abstract

The invention discloses cyanogen-free silver-plating electroplating liquid containing an auxiliary complexing agent. The cyanogen-free silver-plating electroplating liquid containing the auxiliary complexing agent is composed of a silver ion source material, a complexing agent, the auxiliary complexing agent, a supporting electrolyte, an electroplating additive, a pH adjusting agent and the like;the components of the electroplating liquid and the contents are as follows: 30-60 g / L of silver ion source material, 140-200 g / L of complexing agent, 10-50 g / L of auxiliary complexing agent, 10-30 g / L of supporting electrolyte, 100-800 mg / L of electroplating additive and 10-30 g / L of pH adjusting agent. The cyanogen-free silver-plating electroplating liquid containing the auxiliary complexing agent provided by the invention has the advantages that: the electroplating liquid is stable and has low toxicity, the anodic passivation in the electroplating process can be better inhibited, the anodeis normally dissolved, the electroplating liquid can be continuously utilized for long time, the electroplating layer has a good bonding force and is bright, and the electroplating liquid can be applied to multiple fields including decorative electroplating, functional electroplating and the like.

Description

technical field [0001] The invention belongs to the technical field of electrochemical silver plating, and in particular relates to a cyanide-free silver plating solution containing an auxiliary complexing agent. Background technique [0002] The silver-plated layer has high electrical and thermal conductivity, good welding performance, high chemical stability to organic acids and alkalis, and its price is relatively cheap compared to other precious metals. It has been widely used in the electronics industry, decorations, tableware and various kinds of handicrafts and other fields. [0003] Due to the advantages of high current efficiency, good dispersion ability, strong covering ability, and fine crystallization of the coating layer, so far, most of the silver layers at home and abroad have been electroplated with cyanide silver plating process. However, cyanide silver plating solution is highly toxic, seriously pollutes the environment, endangers the health of producers, ...

Claims

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Application Information

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IPC IPC(8): C25D3/46
Inventor 赵健伟
Owner NANJING UNIV
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