Cyanogen-free silver-plating electroplating liquid containing auxiliary complexing agent
An auxiliary complexing agent, cyanide-free silver plating technology, applied in the field of electrochemical silver plating, can solve the problems of little research on anode passivation inhibition, silver electroplating interference, rough and dull coating, etc. The effect of bright adhesion and stable plating solution
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Embodiment 1
[0020] A cyanide-free silver plating solution containing an auxiliary complexing agent, composed of a silver ion source, a complexing agent, an auxiliary complexing agent, a supporting electrolyte, an electroplating additive and a pH regulator, and the specific material composition and concentration are as shown in the table 1. The configuration method is: control the temperature at 50°C, mix the complexing agent, supporting electrolyte and pH regulator evenly, then slowly add the silver ion source, stir until the solution is clear, then add the auxiliary complexing agent to make cyanide-free silver plating The electroplating solution, finally adding electroplating additives therein, stirring evenly and standing for later use. The pH range of the electroplating solution is 8~12, and the plating solution is maintained at 50~60°C during the electroplating process. Then, connect the pretreated metal substrate into the circuit and immerse it in the electroplating solution with a ...
Embodiment 2
[0025] The materials of the cyanide-free silver plating solution containing auxiliary complexing agent are shown in Table 2, and the preparation method is the same as in Example 1. The current density of the electroplating station is 1.0A / dm 2 , plating time is 2min.
[0026] Table 2 Composition of various substances in the cyanide-free silver plating solution containing auxiliary complexing agent
[0027] components specific substance concentration source of silver ions AgCl 40g / L Complexing agent Succinimide 170g / L Auxiliary complexing agent EDTA 20g / L supporting electrolyte K 2 CO 3 15g / L pH regulator KOH 10g / L Electroplating Additives Selenous acid 200mg / L Electroplating Additives Antimony Potassium Tartrate 50mg / L
[0028] Such as figure 2 Shown is the silver-plated copper sample that adopts the above-mentioned bright cyanide-free silver-plating electroplating solution electroplating. ...
Embodiment 3
[0030] The components of the cyanide-free silver plating solution containing auxiliary complexing agent are as shown in Table 3, and the preparation method and test method are the same as in Example 2.
[0031] Table 3 Composition of various substances in the cyanide-free silver plating solution containing auxiliary complexing agent
[0032] components specific substance concentration source of silver ions AgNO 3 30g / L Complexing agent Hein 140g / L Auxiliary complexing agent HEDP 10g / L supporting electrolyte K 2 CO 3 20g / L pH regulator NaOH 15g / L Electroplating Additives L-histidine 200mg / L Electroplating Additives Vanillin 300mg / L
[0033] Such as image 3 Shown is a picture of the prepared LED lead frame electroplated with the above-mentioned bright cyanide-free silver plating solution.
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