Non-preplating type non-cyanide silver-plating electroplate liquid
A cyanide-free silver plating and electroplating solution technology, which is applied in the field of electrochemical silver plating, can solve the problems of stability of the plating solution, high cost of the plating solution, contamination of the plating solution, etc., and achieve good plating adhesion, bright plating adhesion, Good stability of plating solution
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[0018] Example 1
[0019] According to the preparation method of the non-pre-plating type non-cyanide silver plating solution of the present invention, the following compounds are prepared into the non-cyanide silver plating solution
[0020] AgNO 3 17g / L
[0021] Creatinine 34g / L
[0022] KNO 3 50g / L
[0023] KOH 10g / L
[0024] Piperidine 1g / L
[0025] Temperature 10℃~80℃
[0026] According to the electroplating step in the specific embodiment, the cyanide-free silver plating electroplating solution is used for electroplating operation.
Example Embodiment
[0027] Example 2
[0028] According to the preparation method of the non-pre-plating type non-cyanide silver plating solution of the present invention, the following compounds are prepared into the non-cyanide silver plating solution
[0029] AgNO 3 34g / L
[0030] Creatinine 60g / L
[0031] KNO 3 50g / L
[0032] KOH 15g / L
[0033] Glycine 1g / L
[0034] Temperature 10℃~80℃
[0035] According to the electroplating step in the specific embodiment, the cyanide-free silver plating electroplating solution is used for electroplating operation.
Example Embodiment
[0036] Example 3
[0037] According to the preparation method of the non-pre-plating type non-cyanide silver plating solution of the present invention, the following compounds are prepared into the non-cyanide silver plating solution
[0038] AgNO 3 34g / L
[0039] Creatinine 90g / L
[0040] KNO 3 50g / L
[0041] KOH 25g / L
[0042] Cysteine 0.5g / L
[0043] Temperature 10℃~80℃
[0044] According to the electroplating step in the specific embodiment, the cyanide-free silver plating electroplating solution is used for electroplating operation.
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