Method for continuously forming organosilicon heat-conducting patch

Abstract

The invention discloses a method for continuously forming an organosilicon heat-conducting patch. The method sequentially comprises the following steps: preparing organosilicon heat-conducting composition slurry; coating the prepared slurry on an upper lining film and a lower lining film, simultaneously rolling and forming a patch, and dragging and conveying the patch forwards; and conveying the patch to a flat continuous track of a drying channel, continuously conveying the patch forwards, and simultaneously heating and curing the patch in the drying channel. According to the forming method disclosed by the invention, the organosilicon heat-conducting composition is continuously formed into the patch with the required dimension and uniform thickness, and the continuous large-scale production is realized.

Description

technical field [0001] The invention relates to a molding process of an organic silicon heat conduction patch, in particular to a continuous forming method of an organic silicon heat conduction patch. Background technique [0002] As electronic devices pack more powerful features into smaller components, rising temperatures can cause devices to slow down, devices to fail mid-operation, size and space constraints, and many other performance issues. Therefore, temperature control has become one of the crucial challenges in the design, that is, how to effectively remove more heat generated by higher power in the case of tight architecture and smaller and smaller operating space. Heat dissipation components are installed on the heating components to accelerate the heat dissipation. In order to conduct heat efficiently from a heat-generating component to a heat-radiating component, a pressure-sensitive adhesive sheet is generally used for fixing the heat-generating component and...

AI Technical Summary

Problems solved by technology

[0003] In the process of producing silicone heat-conducting patch, it is necessary to make a slurry-like silicone heat-conducting composition into a sheet and then solidify it. At present, in the process of forming a sheet, the small-scale generally fills the heat-conducting composition into the required size. Put it in the mold and then place it in a flat vulcanizing machine to press the tablet and cure it. Although this method is simple, it can only be operated intermittently and the output is small; and it cannot be made into large-sized sheets, and different sizes must be determined in advance, otherwise In the subsequent application of the electronics industry, it will cause a lot of waste of leftover materials

The method that can be mass-produced is scrape coating, which can realize continuous production, large output, and high efficiency. However, this method requires a base material in the thermal pad, which is not suitable for thermally conductive sheets without base material, and scrape-coated forming sheets In the process of making materials, a large amount of organic solvents need to be used. From the consideration of environmental protection and cost, a recycling device is required, and the molding process and equipment are relatively complicated.

Images