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Conductive particle

A technology of conductive particles and particles, which is applied in the direction of conductors, circuits, electrical components, etc., can solve the problems of increased connection resistance between circuit electrodes, short circuit of anisotropic conductive adhesive, poor contact, etc., and achieve high conductivity, Excellent connection reliability and low cost

Active Publication Date: 2012-08-22
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the pitch and area of ​​bumps used as circuit electrodes of ICs for driving liquid crystals have been narrowed along with the high-definition of liquid crystal displays in recent years, the following problems have arisen: anisotropic conductive adhesives The conductive particles flow out between adjacent circuit electrodes and cause a short circuit
[0005] In addition, if the conductive particles flow out between adjacent circuit electrodes, there is a problem that the number of conductive particles in the anisotropic conductive adhesive supplemented between the bump and the glass panel decreases, and the opposing circuit electrodes The connection resistance between them increases, causing poor contact

Method used

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Experimental program
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no. 1 approach

[0050] (conductive particles)

[0051] Such as figure 1 As shown, the conductive particle 8a according to the first embodiment of the present invention includes a core particle 11 and a palladium layer 12 covering the entirety of the core particle 11, a thickness of 20 nm to 130 nm, and a phosphorus concentration of 1 wt % to 10 wt %. Hereinafter, the conductive particles 8a according to the first embodiment are referred to as "mother particles 2a" as appropriate.

[0052]

[0053] The particle size of the core particle 11 used in the present invention is preferably smaller than image 3 The minimum spacing between the first electrode 5 and the second electrode 7. In addition, when the height of the electrodes (interval between electrodes) varies, the particle diameter of the core particles 11 is preferably larger than the variation in height (the maximum interval between electrodes). For these reasons, the particle size of the core particle 11 is preferably 1 to 10 μm, m...

no. 2 approach

[0065] Next, the electroconductive particle which concerns on 2nd Embodiment of this invention, and the manufacturing method of an electroconductive particle are demonstrated. In the following, only the points of difference between the above-mentioned first embodiment and the second embodiment will be described, and descriptions of the same matters between the two will be omitted.

[0066] (conductive particles)

[0067] Such as figure 2 As shown, the conductive particle 8b according to the second embodiment not only includes the core particle 11 and the palladium layer 12, but also includes a plurality of insulating particles 1 arranged on the surface of the palladium layer 12. In this point, it is different from the first embodiment. The conductive particles 8a involved are different.

[0068]

[0069] The insulating particles 1 are preferably inorganic oxides. Assuming that the insulating particles 1 are organic compounds, the insulating particles 1 are deformed durin...

Embodiment 1

[0171]

[0172] A copolymer of 10 g of phenoxy resin (manufactured by Union Carbide, trade name: PKHC) and acrylic rubber (40 parts of butyl acrylate, 30 parts of ethyl acrylate, 30 parts of acrylonitrile, and 3 parts of glycidyl methacrylate, Molecular weight: 850,000) 7.5 g was dissolved in 30 g of ethyl acetate to obtain a 30% by weight solution.

[0173] Next, 30 g of liquid epoxy resin (185 epoxy equivalent, manufactured by Asahi Kasei EPOXY Co., Ltd., trade name: NOVACURE HX-3941) containing a microcapsule latent curing agent was added to the solution, and stirred to prepare an adhesive. solution.

[0174] 4 g of the conductive particles 1 prepared above were dispersed in 10 g of ethyl acetate.

[0175] In such a way that the conductive particles 1 are 37% by weight relative to the adhesive, the above-mentioned particle dispersion is dispersed in the adhesive solution, and the solution is applied to the spacer (siloxane-treated polyparaphenylene) with a roll...

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Abstract

Disclosed is a conductive particle (8b) comprising: a core particle (11); a palladium layer (12) which covers the core particle (11) and which has a phosphorus concentration of between 1 wt% and 10 wt% and a thickness of between 20 nm and 130 nm; and insulating particles (1) which are disposed at the surface of the palladium layer (12) and which have a particle size of between 20 nm and 500 nm.

Description

technical field [0001] The present invention relates to conductive particles. Background technique [0002] There are two methods of mounting liquid crystal driving ICs on glass panels for liquid crystal displays, which can be roughly divided into COG (Chip-on-Glass) mounting and COF (Chip-on-Flex) mounting. [0003] In COG mounting, ICs for liquid crystals are directly bonded to glass panels using anisotropic conductive adhesives containing conductive particles. On the other hand, in COF mounting, ICs for driving liquid crystals are bonded to flexible tapes having metal wiring, and they are bonded to a glass panel using an anisotropic conductive adhesive containing conductive particles. The anisotropy mentioned here means conduction in the pressurized direction and insulation in the non-pressurized direction. [0004] However, since the pitch and area of ​​bumps used as circuit electrodes of ICs for driving liquid crystals have been narrowed along with the high-definition...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/00C22C5/04C23C18/44C23C28/00B22F1/18
CPCC22C5/04B22F2998/00C23C18/44B22F1/025B22F1/18B22F2303/30B22F2301/25H01B1/02H01B5/00
Inventor 赤井邦彦高井健次松泽光晴永原忧子
Owner RESONAC CORPORATION
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