Unlock instant, AI-driven research and patent intelligence for your innovation.

LED (light emitting diode) light source module and manufacturing method thereof

A technology of an LED light source and a manufacturing method, applied in the field of LED light source modules, can solve the problems of increasing system cost and increasing system weight, and achieve the effects of improving light color uniformity, increasing heat dissipation area, and improving heat conduction efficiency

Active Publication Date: 2014-02-19
SUN YAT SEN UNIV
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above patents all mentioned the method of using metal cooling fins behind the circuit board to dissipate heat. This method can achieve better heat dissipation effect, but it will also bring some problems: first, the weight of the system will become larger , which is not advisable for the pursuit of thin and light backlight; secondly, since the production of heat dissipation fins requires mold opening, it also increases the cost of the system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED (light emitting diode) light source module and manufacturing method thereof
  • LED (light emitting diode) light source module and manufacturing method thereof
  • LED (light emitting diode) light source module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] like Figure 1-4 As shown, an LED light source module with good heat dissipation performance includes a substrate 3 with an inverted trapezoidal groove and an LED chip 2 packaged in the groove. The four sides of the groove are plated with aluminum or silver to improve light emission. Reflectivity, the bottom of the groove is provided with a circuit 21 for completing the electrical connection of the LED chip 2, and the LED chip 2 adopts a flip chip. The LED light source module also includes a transparent acrylic plate 1 arranged on the surface of the substrate 3, a sealed cavity is formed between the groove and the acrylic plate 3, and the cavity is filled with silicone oil. The light-emitting surface of the LED chip 2 is coated with three layers of materials, wherein the first and third layers are silica gel layers 22, 24, and the middle layer is a phosphor layer 23; the second silica gel layer 24 coated on the top of the LED chip 2 is made of Film shape or convex lens...

Embodiment 2

[0039] The difference between this embodiment and Embodiment 1 is that in the last step of making the LED light source module, the input and output ports are not closed, but form a circulation loop with the external cooling system, and the cooling medium used in the circulation loop is Silicone oil, to ensure that the cavity is filled with silicone oil and free of air bubbles.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an LED (light emitting diode) light source module. The LED light source module comprises a baseplate with a groove and an LED chip packaged in the groove, wherein a circuit is arranged on the bottom of the groove and used for finishing the electrical connection of the LED chip; and the LED light source module also comprises a transparent material arranged on the surface of the baseplate, a sealed cavity is arranged between the groove and the transparent material, and the cavity is filled with a liquid insulation heat conduction material. The invention also discloses a manufacturing method of the LED light source module. The LED light source module provided by the invention has the advantages that the chip is fully immersed in the insulation heat conduction material, the heat dissipation area is greatly increased, and stereo heat dissipation is formed, so that the temperature of the LED light source module is dropped; the junction temperature can be maintained at a lower temperature when the LED chip is in work, thereby greatly improving the reliability; the thermal conductivity of the insulation heat conduction material is high, the temperature uniformity of each chip is greatly improved, and the photochromic uniformity is also greatly improved; and the heat conduction efficiency of the LED chip is improved, so that the stability of the whole light source module is improved and the service life is prolonged.

Description

technical field [0001] The invention relates to the field of packaging of LED light source modules, in particular to an LED light source module used for a backlight source of a flat panel display and a manufacturing method of the LED light source module. Background technique [0002] In LED light sources, it is often required to use multiple chips to form a light source module, and heat dissipation has become one of the important issues to be considered. For LED chips, if the heat is concentrated inside the chip and cannot be effectively diffused to the surrounding environment, it will lead to an increase in the temperature of the chip junction, causing non-uniform distribution of thermal stress, thereby accelerating the attenuation of the light output of the device, and affecting the reliability of the device. sex. For LED light source modules, if the temperature of different chips is inconsistent, it may lead to inconsistent light attenuation speeds of different chips, re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V29/00F21V7/22H01L25/075H01L33/64H01L33/00F21Y101/02F21V29/58
Inventor 刘立林王钢杨建福熊旺
Owner SUN YAT SEN UNIV