Package structure with antenna and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of large antenna circuit board area and high design and manufacturing costs, and achieve reduced area, design and manufacturing costs Effect
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[0048] According to the first embodiment of the present invention, the package body 12 covers the IC chip 11 and the circuit pattern 18, and two through holes 14 (first through holes), 15 are made at a predetermined position of the package body 12 to expose the circuit pattern An antenna signal terminal and a ground terminal of the high-frequency circuit of 18. A conductive metal layer 13 is plated on the surface of the package body 12, which can be achieved by sputtering or other coating methods, and the conductive metal layer 13 can be gold, silver, copper, aluminum, titanium and alloys thereof or It is other conductive materials. Then, the shape of the antenna pattern 16 and the grounding plane 17 are formed on the conductive metal layer 13 using a laser engraving machine or a traditional yellow photolithography process and an etching process. Finally, the through holes 14 and 15 are filled with a coating method to connect the feed end of the antenna signal of the antenna p...
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