Package structure with antenna and manufacturing method thereof

Abstract

The invention discloses a packaging structure with an antenna and a manufacturing method thereof. The method comprises the following steps of: forming a circuit diagram and an integrated circuit (IC) chip on a substrate, wherein the IC chip is electrically connected with the circuit diagram; covering a package on the substrate to wrap the circuit diagram and the IC chip; and forming an antenna diagram on the package, wherein the antenna diagram is electrically connected with the circuit diagram by using a first through hole passing through the package. Therefore, the antenna can be formed on the package of the circuit board, and the purpose of reducing the area of a circuit board is reduced.

Description

technical field [0001] The invention relates to a method for manufacturing an antenna, in particular to a method for manufacturing an antenna on a packaging body and its structure. Background technique [0002] Due to the advancement of technology, various high-tech electronic products have been developed to facilitate people's life, including various electronic devices, such as notebook computers, mobile phones, personal digital assistants (PDAs), and the like. With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Thereby greatly increasin...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method and structure for making an antenna on the surface of a package, and to provide a method and a structure for making an antenna on the surface of the package simultaneously in order to overcome the defects of the large area of ​​the circuit board occupied by the antenna and the high cost of design and manufacture in the prior art. The method and structure of making the antenna and the electromagnetic shielding layer, and forming a layered structure of the antenna pattern and the electromagnetic shielding layer on the surface of the package, so as to achieve the purpose of reducing the area of ​​the substrate, reducing the design and manufacturing costs, etc.

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