Curable composition for transfer material and (meth)acryloyl group-containing urea compound

A technology of curable composition and transfer material, applied in nanotechnology for information processing, only a part of the coating supported by a magnetic layer, organic chemistry, etc., to achieve the effect of good transferability

Inactive Publication Date: 2011-12-28
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, Patent Document 4 does not describe the use of this material as a resist material for imprinting at all.

Method used

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Examples

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Embodiment 1

Embodiment 2

Embodiment 3

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Abstract

The invention provides curable compositions for transfer materials suited for nanoimprinting, which have very high transfer properties in a nanoimprinting process, show high selectivity in dry etching rate between by argon gas and by oxygen gas, and can be fabricated into fine patterns with high throughput. The curable composition for transfer materials includes a compound (A) having at least one skeleton selected from Formulae (1) to (3) below, and a (meth)acryloyl group:

Description

technical field The present invention relates to a curable composition for transfer material, a method for forming a pattern using the composition, a method for producing a magnetic recording medium using the method, a magnetic recording medium obtained by the production method, and a magnetic recording and reproducing device including the medium , and a urea compound containing a (meth)acryloyl group. Background technique Nanoimprint technology has attracted attention as a method for forming fine patterns in semiconductor manufacturing processes, magnetic recording medium manufacturing processes such as patterned media, and the like, and excellent transfer materials for this nanoimprint technology are required. Thermoplastic resins such as polymethyl methacrylate are generally used as transfer materials for nanoimprinting. In this case, the general process is to heat the coated material to a temperature above the glass transition temperature, press the mold, and remove it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027B29C59/02C07C275/10G11B5/65G11B5/84G11B5/855B29K61/20
CPCG03F7/027G11B5/855B82Y10/00G03F7/0002B82Y40/00C07C275/10B29C59/022G11B5/8412H01L21/0274
Inventor 新井良和内田博
Owner SHOWA DENKO KK
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