Preparation method for quartz wafer crystal block of surface mounted device (SMD)

Abstract

The invention relates to a preparation method for a quartz wafer crystal block of a surface mounted device (SMD). The method comprises the following steps of: (1) arranging a plurality of wafers stacked and arranged to form a block into a flat bottom container containing an ultraviolet adhesive in a way that sides X or Z are vertical by using a fixture until the wafers are all impregnated in the ultraviolet adhesive; (2) taking the wafers impregnated with the adhesive out, and arranging the wafers in a block adhesion fixture for fixation; and (3) arranging the fixed crystal block under an ultraviolet illuminating lamp for irradiation, and taking the crystal block out after the adhesive is cured to obtain an expected product. By the method, the wafers are adhered by the ultraviolet adhesive, heating is required by an adhesion process, operations are safe, an operating environment can be improved, energy sources can be saved, the machined crystal block is easy to unblock, the wafer is easy to clean and the quality of the wafer is not influenced.

Description

technical field [0001] The invention relates to a method for preparing an SMD quartz wafer crystal ingot. Background technique [0002] At present, the market has relatively high requirements for the external dimensions of quartz crystal frequency chips, especially the SMD series chips with very promising development prospects. The shape requirements of miniaturized chips have also increased a lot. Due to the small size of the wafer, its dimensions are usually processed by bonding multiple wafers with an adhesive to form a crystal ingot. Fusion into a glue solution, and at the same time, divide the wafers that need to be shaped into a certain number of ingots, and place a protective glass on both ends of each ingot, and place the crystal ingots in rows on a high-temperature heating plate, keeping a certain gap between each row. The wafer needs to be placed on the heating plate and heated for a period of time, in order to use the high temperature to discharge the air in the...

AI Technical Summary

Problems solved by technology

But this method has many hazards: high temperature is extremely harmful to employees, and it is easy to cause employee injuries. At the same time, the particles of rosin, beeswax and other objects are relatively large, and the adsorption and permeability are not very ideal. And the verticality of the wafer has certain adverse effects, and as the weather season changes, it is also necessary to change the ratio of the adhesive so that it can be better used for production

This kind of adhesive is not easy to dissolve and clean in the process of mounding after the end of shape processing, and it is difficult to clean. In the process of mounding, strong acids such as sulfuric acid and nitric acid must be used to dissolve colloids. The irritating gases produced are prone to harm to the personal safety of employees and cause pollution to the environment