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Conveying system for integrated circuit chip loader framework

An integrated circuit and conveying system technology, which is applied in the field of fully automatic conveying system, can solve the problems of low production efficiency, pollution, lack of free adjustment function and precise control of the conveying track size, and achieve the effect of high degree of automation and precise control

Active Publication Date: 2012-01-11
南通金泰科技有限公司
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

In the specification of patent 200710019239.3, the method of applying glue on the lead frame of integrated circuits disclosed in the specification has no precise control parts in the conveying mechanism, so the method of partially covering the film is adopted, which leads to low production efficiency and pollution.
A quartz wafer loader disclosed in patent 200720094963.8 has no free adjustment function and precise control function for the size of the conveying track, and is not suitable for the use and precise control of series products

Method used

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  • Conveying system for integrated circuit chip loader framework
  • Conveying system for integrated circuit chip loader framework
  • Conveying system for integrated circuit chip loader framework

Examples

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Embodiment Construction

[0014] Select the feeding manipulator 3 and the feeding sensor 4 with appropriate specifications and functions as the feeding mechanism 5; select several sets of gripper sets 9, two rails 7, drive elements 1, and rail sensors 2 with appropriate specifications and functions to manufacture Be track mechanism 8; Choose the blanking manipulator 12 of suitable specification and function, blanking sensor 14 to make as blanking mechanism 13; Select the program-controlled equipment 15 that the program-controlled software of pre-programmed program has been installed for use.

[0015] Put each component in accordance with figure 1 connected as shown. The lead frame 11 is now conveyed into the blanking unit 10, the width 16 between the jaw groups and the thickness 17 between the jaw groups match the size of the lead frame 11, and the width 16 between the jaw groups passes between the jaw groups. The distance between them is adjusted, and the thickness 17 between the jaw groups is regula...

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Abstract

The invention provides a conveying system for an integrated circuit chip loader framework. The conveying system comprises a feeding mechanism, a track mechanism, a discharging mechanism and program controlled equipment, wherein the feeding mechanism comprises a feeding mechanical hand and a feeding sensor, an open type platform is adopted for the track mechanism, the width and the thickness of a lead framework groove in the track mechanism can be regulated, the discharging mechanism comprises a discharging mechanical hand and a discharging sensor, and the conveying system is driven by a ball screw driven a motor. The conveying system is suitable for conveying lead frameworks of various specifications, is accurate in feeding amount control and high in automation degree, and can be used in an integrated circuit chip loader in scale production.

Description

technical field [0001] The invention relates to a conveying system of an integrated circuit chip mounter, in particular to a fully automatic conveying system of an integrated circuit lead frame capable of precise control. Background technique [0002] Picking and loading the integrated circuit chip on the integrated circuit lead frame is the key operation step of the integrated circuit chip mounter. Usually, the conveying system of the integrated circuit chip loader includes a feeding mechanism, a track mechanism, and an unloading mechanism. In the traditional integrated circuit chip loading machine, it is difficult to realize the automatic operation of the lead frame picking, transmission and placement, the production efficiency is low, the chip loading accuracy is low, and it is difficult to adapt to the use of lead frames of different sizes. A feeding mechanism for integrated circuits disclosed in the specification of patent 200720131627.9, although a manipulator is used...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50
Inventor 刘建峰徐银森李承峰胡汉球苏建国吴华
Owner 南通金泰科技有限公司
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