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Low-ablation lead-free tin plating alloy under high temperature

A tin alloy and erosion technology, which is applied in the field of tin-based alloys and lead-free tin-coating alloys, can solve problems such as rapid dissolution of copper, achieve slow dissolution speed and reduce production costs

Inactive Publication Date: 2012-02-01
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the problem of rapid dissolution of copper in liquid tin during high-temperature tinning, the present invention provides a new low-corrosion lead-free tin-based alloy for high-temperature tinning

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] By weight percentage, prepare Ni 0.5%, Ag 0.01%, Ga 0.01%, Si 0.005%, the rest is the Sn-Ni alloy of Sn, selects a kind of common smelting technology to melt industrial pure Sn, then adds Weighed various alloying elements, after they are fully dissolved in liquid Sn, they are stirred evenly and cast into ingots for later use.

[0024] Take the alloy and place it in an open crucible, heat and melt it with a muffle furnace, and raise the temperature to 400°C for 30 minutes to make the temperature of the liquid Sn alloy uniform. Take a section of thin copper wire (Φ0.6mm) with an enameled wire, dip one end into the pre-prepared flux, remove the excess flux, and then immerse it in the prepared liquid Sn-based alloy. After 2 minutes, the surface of the copper wire A layer of Sn has been enameled, soaked in liquid Sn for 5 minutes, and the diameter of the copper wire is taken out to measure 0.5mm. It can be seen that the dissolution rate of the copper wire in the Sn-based all...

Embodiment 2

[0026] By weight percentage, prepare Ni 1.0%, Cu 0.03%, Ge 0.02%, the rest is the Sn-Ni alloy of Sn, adopts the same experiment method with embodiment 1, tin enamel directly at 400 ℃, has obtained good effect.

Embodiment 3

[0028] In terms of weight percentage, a Sn-Ni alloy containing 0.3% Ni, 0.02% P, and the rest being Sn was prepared, and the same experimental method as in Example 1 was used to directly enamel tin at 350° C., and good results were obtained.

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Abstract

The invention belongs to the field of electronic and electric appliance manufacturing, and relates to tin-based alloy used in high-temperature tin thermal-plating (tin plating) on surfaces of electronic and electric element weld joints. Specifically, the invention provides a Sn-Ni based low-ablation lead-free tin plating alloy under a high temperature. The alloy comprises chemical components of, by weight: 0.1 to 1.5% of Ni, 0.001 to 0.1% of third group components (wherein the third group components indicate one or a composition of components selected from Ag, Cu, Si, P, Ge, Al, Ga, and Ti), and balance of Sn and inevitable impurities. Compared to common tin alloys, the alloy provided by the invention is advantaged in that: a heavy metal lead is not contained in the alloy; and under a relatively high tin plating temperature (300 to 400 DEG C), the ablation speed of the alloy upon a copper substrate is slow. Therefore, the alloy can be widely applied in lead-free surface tin plating technologies of various elements under a high temperature, wherein the elements are manufactured from Cu, Fe, Al, or alloys thereof. The alloy is especially suitable for high-temperature lead-free tin plating technologies on surfaces of small-sized Cu or Cu alloys.

Description

technical field [0001] The invention belongs to the field of electronics and electrical appliances manufacturing, and relates to a tin-based alloy used for high-temperature hot-dip tinning (tinning) on ​​the surface of solder feet of electronic and electrical components, in particular to a Sn-Ni-based lead-free alloy with low melting corrosion at high temperature Tin alloy. Background technique [0002] In the field of electronics and electrical appliances manufacturing industry, soldering with tin-based solder is one of the most commonly used connection techniques, mainly used in electrical and mechanical connections between metals. In modern industry, copper is currently the best conductive metal, so soldering is mainly used for the connection of copper and copper alloys. Due to being placed under natural conditions, there is a natural oxide film on the surface of copper or copper alloy. During actual welding, molten tin-based solder is not easy to spread and wet on the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00
Inventor 冼爱平杨泽焱
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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