Application of a Lead-free Tin Lining Alloy with Low Corrosion at High Temperature

A tin alloy, high temperature technology, applied in the application of lead-free tin alloys, tin-based alloys, can solve the problem of rapid dissolution of copper, achieve the effect of slow dissolution and reduce production costs
CN102337422BInactive Publication Date: 2015-12-09INST OF METAL RESEARCH - CHINESE ACAD OF SCI

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
Publication Date
2015-12-09
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention belongs to the field of electronic and electric appliance manufacturing, and relates to tin-based alloy used in high-temperature tin thermal-plating (tin plating) on surfaces of electronic and electric element weld joints. Specifically, the invention provides a Sn-Ni based low-ablation lead-free tin plating alloy under a high temperature. The alloy comprises chemical components of, by weight: 0.1 to 1.5% of Ni, 0.001 to 0.1% of third group components (wherein the third group components indicate one or a composition of components selected from Ag, Cu, Si, P, Ge, Al, Ga, and Ti), and balance of Sn and inevitable impurities. Compared to common tin alloys, the alloy provided by the invention is advantaged in that: a heavy metal lead is not contained in the alloy; and under a relatively high tin plating temperature (300 to 400 DEG C), the ablation speed of the alloy upon a copper substrate is slow. Therefore, the alloy can be widely applied in lead-free surface tin plating technologies of various elements under a high temperature, wherein the elements are manufactured from Cu, Fe, Al, or alloys thereof. The alloy is especially suitable for high-temperature lead-free tin plating technologies on surfaces of small-sized Cu or Cu alloys.
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Description

technical field

[0001] The invention belongs to the field of electronics and electrical appliances manufacturing, and relates to a tin-based alloy used for high-temperature hot-dip tinning (tinning) on ​​the surface of solder feet of electronic and electrical components, in particular to a Sn-Ni-based lead-free alloy with low melting corrosion at high temperature Application of tin enamel alloy. Background technique

[0002] In the field of electronics and electrical appliances manufacturing industry, soldering with tin-based solder is one of the most commonly used connection techniques, mainly used in electrical and mechanical connections between metals. In modern industry, copper is currently the best conductive metal, so soldering is mainly used for the connection of copper and copper alloys. Due to being placed under natural conditions, there is a natural oxide film on the surface of copper or copper alloy. During actual welding, molten tin-based solder is not easy to s...

Claims

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