Application of a Lead-free Tin Lining Alloy with Low Corrosion at High Temperature
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INST OF METAL RESEARCH - CHINESE ACAD OF SCI
- Publication Date
- 2015-12-09
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention belongs to the field of electronics and electrical appliances manufacturing, and relates to a tin-based alloy used for high-temperature hot-dip tinning (tinning) on the surface of solder feet of electronic and electrical components, in particular to a Sn-Ni-based lead-free alloy with low melting corrosion at high temperature Application of tin enamel alloy. Background technique
[0002] In the field of electronics and electrical appliances manufacturing industry, soldering with tin-based solder is one of the most commonly used connection techniques, mainly used in electrical and mechanical connections between metals. In modern industry, copper is currently the best conductive metal, so soldering is mainly used for the connection of copper and copper alloys. Due to being placed under natural conditions, there is a natural oxide film on the surface of copper or copper alloy. During actual welding, molten tin-based solder is not easy to s...