Expansion refrigeration system of high-power semiconductor laser

Abstract

The invention discloses an expansion refrigeration system of a high-power semiconductor laser, comprising a refrigeration compressor, a condenser and a laser refrigeration packaging assembly in sequent communication based on a refrigerant flow, wherein the laser refrigeration packaging assembly is provided with an expansion cavity, an refrigerant is expanded, evaporated and gasified in the expansion cavity of the laser refrigeration packaging assembly and then returns to an inlet of the refrigeration compressor; and a semiconductor laser array is in heat conduction connection with an externalwall of the expansion cavity. According to the invention, an expanded and refrigerated capillary tube and an evaporator assembly are arranged in the laser refrigeration packaging assembly, thus the expansion refrigeration system has larger refrigerator power, and has a preferable cooling effect when being applied to the high power semiconductor laser array, as well as overcomes the defects such as high manufacturing accuracy, complicated process, large volume and high pressure in the prior art, thereby saving energy sources; and an independent cooling water precooling system is not used in the expansion refrigeration system, and the expansion refrigeration system is simple in structure, operated conveniently, and low in use cost, thus reducing the cost of a semiconductor laser cooling system, and improving the service life of the semiconductor laser.

Description

technical field [0001] The invention relates to a semiconductor laser cooling system, in particular to a high-power semiconductor laser cooling system. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, long life, and high electro-optical conversion efficiency, and have been widely used in various fields of science and technology and national economy. Since the invention of superlattice quantum well laser materials, with the needs of practical engineering development, the output power of semiconductor lasers has become higher and higher, and the heating power density is also larger (up to 4-6W / mm 2 ), which puts high demands on cooling technology and devices. [0003] In the prior art, the cooling effect of high-power semiconductor laser arrays with continuous or quasi-continuous output is better than that of microchannel cooling invented by the Livermore National Laboratory of the University of California in 1992 and put int...

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Problems solved by technology

[0005] In the above-mentioned technical scheme, the manufacturing precision of the device is high, the process links are many and complicated, the yield rate is low, and the manufacturing cost is increased, which greatly restricts the popularization and use of micro-channel cooling package components; The required refrigeration system and cooling water circulation system also have special requirements. High pressure (about 0.5Mpa) pure water must be used for cooling, and the cooling water used must also be pre-cooled. A large high-pressure water cooling system is required, which is small in size with semiconductor lasers. The advantages are not compatible, which affects the convenience of use

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