A kind of LED module and its manufacturing process

Abstract

The invention relates to an LED (Light-Emitting Diode) module and a manufacturing process thereof. The LED module comprises a metal substrate, a PCB (Printed Circuit Board) and an LED chip, wherein the PCB is fixed on the metal substrate; the metal substrate is provided with at least one concave pit; the LED chip is fixed in the concave pit; and the two poles of the LED chip are connected with the PCB respectively. The LED chip is directly welded on the circuit board, so that the conventional LED encapsulating process is eliminated, a bracket comprising a heat sink is eliminated, heat of the LED chip is directly diffused to a high-heat-conductivity circuit board and a radiator, and the radiating effect is enhanced.

Description

technical field [0001] The invention relates to the field of semiconductor application and packaging, more specifically, to an LED module and its manufacturing process. Background technique [0002] With the development of LED chip technology and packaging technology, more and more LED products are used in the field of lighting, especially high-power white LEDs. Due to the characteristics of high light efficiency, long life, energy saving and environmental protection, suitable dimming control, and no mercury and other pollutants, LEDs have become a new generation of lighting sources after traditional light sources such as incandescent lamps and fluorescent lamps. [0003] LED is an electroluminescent semiconductor device, in which about 30% of the electrical energy is converted into light, and the remaining electrical energy is converted into heat, and the temperature rise of LED caused by heat accumulation is the main cause of LED light decay. Therefore, LED chip heat diss...

AI Technical Summary

Problems solved by technology

The above-mentioned LED module has the following defects: since the heat dissipation of the LED chip needs to pass through many interlayers in the heat conduction channel, and the medium between the LED heat sink and the circuit board 102, and between the circuit board 102 and the heat sink 101 is air or silicone grease, the middle Vias have low thermal conductivity, so thermal performance is poor

[0007] For general LED application lamps, after the light is emitted from the chip, it generally passes through: phosphor, packaging lens, air, light distribution lens, and then to the light transmission cover. The light passes through many media, and reflection loss occurs at each interface, so the total low optical transmittance

Therefore, there are disadvantages such as poor heat dissipation performance, low optical transmittance, complicated production process, and high cost.

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