Manufacturing method of mechanical conduction hole circuit board without holes on surface
A circuit board manufacturing and via hole technology, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of scrapping, high production cost, touch screen failure, etc., achieve simple process, reduce production cost, and protect the touch screen Effect
Inactive Publication Date: 2012-02-29
广东达进电子科技有限公司
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Problems solved by technology
In some cases where there are certain requirements on the surface flatness of the circuit board, such as the circuit board below the touch screen, when the touch screen is touched, due to the via holes on the existing circuit board, the force on the touch screen will be uneven and it will be damaged. Cause damage, which will cause the touch screen to malfunction or even be scrapped in the long run
[0003] Some current circuit boards generally retain the via holes on the circuit board, and the manufacturing process of the circuit board is complicated. It is necessary to drill the via holes and press the circuit board multiple times, and the drilling is usually done by laser drilling. hole, high production cost
Method used
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[0038] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:
[0039] Such as figure 1 , figure 2 Shown, a kind of manufacturing method of the mechanical conduction hole of surface non-porous circuit board is characterized in that comprising the following steps:
[0040] A. Cutting, cutting the circuit board sheet according to the required size;
[0041] B. Paste a photosensitive dry film, paste a photosensitive dry film on the surface of the board, and the photosensitive dry film will undergo a polymerization reaction under the irradiation of a certain beam (usually ultraviolet rays) to form a stable substance attached to the board surface;
[0042] C. Transfer of the inner layer circuit pattern, using film (film) exposure technology to expose the inner layer circuit pattern on the photosensitive film to the photosensitive dry film attached to the surface of the sheet, and the hollowed out light-transmi...
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The invention discloses a manufacturing method of a mechanical conduction hole circuit board without holes on a surface. The method comprises the following steps: A. cutting board; B. sticking a photosensitive dry film; C. transferring an inner layer circuit image; D. etching the inner layer circuit image; E. performing an AOI detection to the inner layer circuit; F. browning and stitching; G. drilling a conduction hole; H. coating copper on the conduction hole; I. filling the conduction hole; J. drilling a component hole and a location hole; K. depositing the copper; L. electroplating the whole board; M. sticking the photosensitive dry film on a plate surface of a substrate; N. transferring an inner layer circuit image outer layer circuit image; O. electroplating the outer layer circuit image; P. etching the outer layer circuit image; Q. performing the AOI detection to the outer layer circuit; R. performing green oil and character silkscreen; S. moulding; T. performing middle inspertion; U. performing surface treatment; V. performing final inspection. A purpose of the invention is to provide the manufacturing method of the mechanical conduction hole circuit board without the holes on the surface. The method has the following characteristics that: a making technology is simple and costs are low. By using the method, a touch screen on the circuit board can be effectively protected.
Description
【Technical field】 [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing a circuit board with non-porous mechanical vias on the surface. 【Background technique】 [0002] When the circuit between the layers of the circuit board needs to be turned on, a through hole is usually drilled at the position that needs to be turned on, and then the copper layer is electroplated in the through hole to connect the circuit that needs to be turned on between the layers. In some cases that have certain requirements on the surface flatness of the circuit board, such as the circuit board below the touch screen, when the touch screen is touched, due to the via holes on the existing circuit board, the force on the touch screen will be uneven and it will be damaged. Damage will cause the touch screen to malfunction or even be scrapped in the long run. [0003] Some current circuit boards generally retain the via holes on the circ...
Claims
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IPC IPC(8): H05K3/00H05K3/42
Inventor 王斌陈华巍陈毅谢兴龙朱忠星
Owner 广东达进电子科技有限公司