Packaging method of SMD type LED with lens

A packaging method and LED patch technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inability to realize mechanical automation, internal bubbles, low production efficiency, etc., and achieve good consistency, high output, and bonding force. Good results

Inactive Publication Date: 2012-03-07
HUBEI KUANGTONG ELECTRONICS
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at the same time, there is a bad phenomenon that filling the silicone lens will produce internal air bubbles, and the production efficiency is low.
There is also a process of pointing silicone in the PPA bracket

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0012] A packaging method for an SMD LED with a lens, comprising the following steps:

[0013] Step 1: Arrange the electroplated SMD LED chip bracket directly, dispense glue on the die bonder to fix the chip, then put the fixed chip bracket box into the oven, bake the die-bonding glue to cure it, and make the chip and the bracket The box is firmly glued.

[0014] Step 2: Put the cured chip holder box into the wire bonding machine, and use gold wire or alloy wire to effectively and reasonably bond the chip P / N junction and the holder.

[0015] Step 3: Directly discharge the bonded bracket into the forming mold with lens, inject silicone resin or silica gel into the forming mold through a press, and transfer the glue for 100 seconds. That is, the silicone rubber cake or A / B silica gel is injected into the mold cavity of 150 ℃ according to a certain amount, and then the mold is closed and the glue is injected quickly. The injection pressure is 35±2㎏ / c㎡, the time is 35 seconds, a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a packaging method of an SMD type LED with a lens. Slice arrangement is directly carried out an electroplated SMD type LED patch support; adhesive dispersing is carried out on a die bonder to fix a chip; a fixed chip support box is placed in an oven and a crystal bonding adhesive is baked, so that the fixed chip support box is solidified; and then the solidified chip support box is placed in a welding wire machine and a gold wire or an alloy wire are employed to enable a P/N junction of the chip to be bonded with the support; and the bonded support is directly discharged into a moulding die with a lens and a press machine is utilized to inject a silicon resin or a silica gel into the moulding die, so that one-time injection moulding of an SMD type LED with a lens is completed. According to the packaging method of the SMD type LED with a lens in the invention, an injection method is utilized to produce the SMD type LED with a lens; and the output is high and the consistency is high; besides, the LED has high surface smooth finish and is free of air bubbles; a bonding force between materials is good; and injection and moulding can be completed once.

Description

technical field [0001] The invention relates to a packaging method for an SMD LED with a lens. Background technique [0002] SMD LED Market Prospects: SMD LED Light Emitting Diode: SMD LED is a new type of surface mount semiconductor light emitting device, which has the advantages of small size, large scattering angle, good luminous uniformity and high reliability. The luminous color includes white light in Various colors inside, so it is widely used in various electronic products. Especially when it comes to large-size LED backlighting and LED lighting. [0003] Traditional SMD LED packaging process with lens: The bracket is first treated with silver electroplating, and PPA engineering plastic is injected on the silver-plated bracket, and then the process of solid crystal, baking, wire bonding and baking is completed. Then cover the lens model on the PPA base, inject silicone into the glue injection hole on the edge of the base and the lens model, put the silicone holder ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/00H01L33/48
Inventor 李胜刚李子龙
Owner HUBEI KUANGTONG ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap