Packaging method of SMD type LED with lens
A packaging method and LED patch technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inability to realize mechanical automation, internal bubbles, low production efficiency, etc., and achieve good consistency, high output, and bonding force. Good results
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[0012] A packaging method for an SMD LED with a lens, comprising the following steps:
[0013] Step 1: Arrange the electroplated SMD LED chip bracket directly, dispense glue on the die bonder to fix the chip, then put the fixed chip bracket box into the oven, bake the die-bonding glue to cure it, and make the chip and the bracket The box is firmly glued.
[0014] Step 2: Put the cured chip holder box into the wire bonding machine, and use gold wire or alloy wire to effectively and reasonably bond the chip P / N junction and the holder.
[0015] Step 3: Directly discharge the bonded bracket into the forming mold with lens, inject silicone resin or silica gel into the forming mold through a press, and transfer the glue for 100 seconds. That is, the silicone rubber cake or A / B silica gel is injected into the mold cavity of 150 ℃ according to a certain amount, and then the mold is closed and the glue is injected quickly. The injection pressure is 35±2㎏ / c㎡, the time is 35 seconds, a...
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