Fully-automatic patch-type LED die bonder with new operation flows

Abstract

The invention discloses a fully-automatic patch-type LED die bonder with new operation flows. The invention relates to the technical field of LED manufacturing equipment, in particular to a fully-automatic patch-type LED die bonder, which comprises a base, wherein the base is provided with a front end facing to an operator and a back end back to the front end; a dispensing device and a chip picking and placing device are arranged on the base; and feed materials on the base are conveyed to a region between the dispensing device and the chip picking and placing device from the front end and / or back end of the base in a unidirectional or bidirectional way. The fully-automatic patch-type LED die bonder breaks through the operation mode and the layout structure of the traditional die bonder; a working mode of front-in and back-out or front-in and front-out as well as back-in and back-out is adopted and a region at the back end of the base is fully utilized, so that the structure layout is easier, the structure combination is optimized, and feed materials and discharged materials flow more smoothly, therefore the production efficiency is improved, the operation rate and the operability of equipment are greatly improved, unnecessary interference during die bonding is reduced, and the production progress and the die bonding quality are ensured; and the operation of the front ends and the back ends of different die bonders can be mastered by one person, therefore human resources are saved and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of LED manufacturing equipment, in particular to an LED crystal bonding machine. Background technique [0002] Die bonding machine is an important equipment for the production of light-emitting diodes (LED). Its working process is as follows: first, the feeding system transports the die-bonding support in the storage device to the feeding channel, and then the die-bonding support moves along the feeding channel and Stay at a certain position, at this time, the dispensing device on the base automatically dispenses the adhesive substance, that is, the adhesive substance is placed on the die-bonding area of ​​the die-bonding bracket, and then the chip is taken from the wafer by the automatic pick-and-place device, and The chip is bonded to the die-bonding area of ​​the die-bonding bracket to complete the die-bonding. Finally, the die-bonding bracket that has completed the die-bonding work continues to move alon...

AI Technical Summary

Problems solved by technology

This structure has the following defects: 1. Due to the setting of the left and right directions of the feeding channel, its inlet and outlet are located on the left and right side ends of the machine base, and usually the activity space at the left and right side ends of the machine base is relatively narrow, which brings a lot of inconvenience to the operation of feeding and discharging materials. It is not conducive to the layout of the transmission mechanism and affects the design concept of automated mass production of equipment

2. The dispensing module and the wafer are distributed on the same side of the feeding channel, and there are several die-bonding areas on the die-bonding bracket. The distance between different die-bonding areas and the dispensing module and the wafer is inconsistent. During arm dispensing and die bonding, it is very easy for work to interfere with each other, which affects the production process and the quality of die bonding, which in turn leads to a high defect rate in production and an increase in cost

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