Epoxy resin microcapsule latent curing agent and preparation method thereof
A technology of latent curing agent and epoxy resin, which is applied in the direction of epoxy resin glue, microcapsule preparation, microsphere preparation, etc., can solve the problems of no discovery, short shelf life of products, brittle colloid and easy to break, and achieve easy operation, Superior Performance, Effects in Mild Conditions
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Example Embodiment
[0029] Example 1:
[0030] 1. Preparation of component A:
[0031] Add 100 parts of epoxy resin a (industrial grade) with epoxy equivalent of 149 into the reaction flask, stir and heat to 105°C, add 33% bisphenol A (industrial grade) with a weight ratio of 33% and a weight ratio It is 0.14% tetrabutyl ammonium bromide; react at 125°C and use the hydrochloric acid acetone method (HG2-741-72) to determine its epoxy value. When the epoxy value is less than 0.285, stop the reaction and cool to below 40°C.
[0032] 2. Preparation of synthetic resin:
[0033] ① 100 parts of epoxy resin b (industrial grade) with epoxy equivalent of 189 is stirred and heated to 105°C, and hexafluorobisphenol A (industrial grade) with a weight ratio of 23% to b and 0.2 weight ratio to b are added in sequence % Of tetrabutylammonium bromide;
[0034] ②Heat up to 120℃ for 30min;
[0035] ③Add bisphenol A with a weight ratio of 10.5% to b, and react at 120°C for 2h;
[0036] ④Add component A;
[0037] ⑤ Add dropwise...
Example Embodiment
[0051] Example 2
[0052] Preparation of component A, preparation of synthetic resin, preparation of adducts, microencapsulation of adducts and performance test refer to Example 1. Among them, the weight percentage of each component in the preparation of epoxy resin microcapsule latent curing agent is shown below Table 1.
[0053] Table 1
[0054] Component Core Wall material Solvent Dispersant Release agent Component name Adduct Ethyl cellulose Cyclohexane BNK-NSF480 paraffin Weight percentage251639.51.5
[0055] The epoxy resin microcapsule latent curing agent prepared in Example 2 is formulated with epoxy resin in an amount of 25% of the epoxy ratio to form an adhesive. It can be completely cured at 110°C-120°C in 25 minutes, and it stretches out. The length rate is 10%, the shear strength is 55 MPa, the bonding strength can reach more than 15Mpa, and the shelf life can be stored for 17 days at 40 ℃.
Example Embodiment
[0056] Example 3
[0057] Preparation of component A, preparation of synthetic resin, preparation of adducts, microencapsulation of adducts and performance test refer to Example 1. Among them, the weight percentage of each component in the preparation of epoxy resin microcapsule latent curing agent is shown below Table 2.
[0058] Table 2
[0059] Component Core Wall material Solvent Dispersant Release agent Component name Adduct Ethyl cellulose Cyclohexane BNK-NSF228 Polyethylene wax Weight percentage270.87011.2
[0060] The epoxy resin microcapsule latent curing agent prepared in Example 3 is formulated with epoxy resin in an amount of 30% of the epoxy ratio to form an adhesive. It can be completely cured at 110°C-120°C in 18 minutes, and it stretches out. The length rate is 15%, the shear strength is 42 MPa, the bonding strength can reach more than 13Mpa, and the shelf life can be stored for 15 days at 40°C.
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