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Epoxy resin microcapsule latent curing agent and preparation method thereof

A technology of latent curing agent and epoxy resin, which is applied in the direction of epoxy resin glue, microcapsule preparation, microsphere preparation, etc., can solve the problems of no discovery, short shelf life of products, brittle colloid and easy to break, and achieve easy operation, Superior Performance, Effects in Mild Conditions

Inactive Publication Date: 2012-03-28
JIAOZUO ZHUOLI STAMPING MATERIAL CO., LTD.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are many types of latent curing agents for epoxy resin, there are two main defects in the products currently on the market: the colloid is brittle and easy to break after curing, and the product has a short shelf life. So far, no one with particularly good performance has been found, which is very ideal latent curing agent

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Preparation of component A:

[0031] Add 100 parts of epoxy resin a (industrial grade) with an epoxy equivalent of 149 into the reaction flask, stir and heat to 105°C, add bisphenol A (industrial grade) with a weight ratio of 33% to a, and a weight ratio of a It is 0.14% tetrabutylammonium bromide; react at 125°C, use the hydrochloric acid acetone method (HG2-741-72) to measure its epoxy value, stop the reaction when the epoxy value is less than 0.285, and cool down to below 40°C;

[0032] 2. Preparation of synthetic resin:

[0033] ① Stir and heat 100 parts of epoxy resin b (industrial grade) with an epoxy equivalent of 189 to 105°C, add hexafluorobisphenol A (industrial grade) with a weight ratio of 23% to b, and a weight ratio of 0.2 to b % tetrabutylammonium bromide;

[0034] ②Raise the temperature to 120°C for 30 minutes;

[0035] ③ Add bisphenol A with a weight ratio of 10.5% to b, and react at 120°C for 2 hours;

[0036] ④Add component A;

[0037] ⑤ At 11...

Embodiment 2

[0052] Preparation of component A, preparation of synthetic resin, preparation of adducts, microencapsulation of adducts and performance testing refer to Example 1, wherein the weight percentage of each component in the preparation of epoxy resin microcapsule latent curing agent is as follows Table 1.

[0053] Table 1

[0054] components Core wall material solvent Dispersant Release agent component name Adduct Ethyl cellulose Cyclohexane BNK-NSF480 paraffin weight percentage 25 1 63 9.5 1.5

[0055] The latent curing agent for epoxy resin microcapsules prepared in Example 2 is prepared into an adhesive with epoxy resin in an amount of 25% of the epoxy ratio, which can be completely cured at 110°C-120°C for 25 minutes, and its tensile strength at break is The elongation rate is 10%, the shear strength is 55MPa, the bonding strength can reach more than 15Mpa, and the shelf life can be stored at 40°C for 17 days.

Embodiment 3

[0057] Preparation of component A, preparation of synthetic resin, preparation of adducts, microencapsulation of adducts and performance testing refer to Example 1, wherein the weight percentage of each component in the preparation of epoxy resin microcapsule latent curing agent is as follows Table 2.

[0058] Table 2

[0059] components Core wall material solvent Dispersant Release agent component name Adduct Ethyl cellulose Cyclohexane BNK-NSF228 polyethylene wax weight percentage 27 0.8 70 1 1.2

[0060] The latent curing agent for epoxy resin microcapsules prepared in Example 3 is prepared into an adhesive with epoxy resin in an amount of 30% of the epoxy ratio, which can be completely cured at 110°C-120°C in 18 minutes, and its tensile strength at break is The elongation rate is 15%, the shear strength is 42 MPa, the bonding strength can reach more than 13 MPa, and the shelf life can be stored at 40 ° C for 15 days.

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Abstract

The invention relates to an epoxy resin latent curing agent, in particular to an epoxy resin microcapsule latent curing agent synthesized from acrylic modified resin and a preparation method thereof. The epoxy resin microcapsule latent curing agent is prepared from the following raw materials in percentage by weight: 10-30 percent of addition compound, 50-80 percent of cyclohexane, 0.5-1.5 percent of ethyl cellulose, 1-10 percent of dispersant and 0.5-1.5 percent of release agent. The quality guarantee period of an adhesive which is prepared from the epoxy resin microcapsule latent curing agent and the epoxy resin is more than 15 days at the temperature of 40 DEG C, the binding strength reaches over 10Mpa, and the elongation at break is 8-15 percent; and the adhesive can be widely appliedto adhesion of electronic elements in electronic industry, adhesion of plastic and furniture and the like.

Description

technical field [0001] The invention relates to an epoxy resin latent curing agent, in particular to an epoxy resin microcapsule latent curing agent synthesized from an acrylic modified resin and a preparation method thereof. Background technique [0002] A latent curing agent refers to a one-component system that is added to an epoxy resin and has a certain storage stability at room temperature, and can quickly undergo a curing reaction under conditions such as heating, light, humidity, and pressure. Hardener. Although there are many types of latent curing agents for epoxy resins, there are two main defects in the products currently on the market: the colloid is brittle and easy to break after curing, and the product has a short shelf life. So far, no one with particularly good performance has been found, which is very ideal latent curing agent. Contents of the invention [0003] The invention provides an epoxy resin microcapsule latent curing agent with superior perfor...

Claims

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Application Information

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IPC IPC(8): C08G59/40C08G59/17B01J13/02C09J163/00C09J11/08
Inventor 刘海军李恒高伟军
Owner JIAOZUO ZHUOLI STAMPING MATERIAL CO., LTD.
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