Device and method for controlling glue joint curing deformation of dissimilar material

A technology for curing deformation and dissimilar materials, applied in the bonding method of adhesive heating, temperature control without auxiliary power supply, etc., can solve the problems of high cost, reduced adhesive connection strength, inability to eliminate deformation, etc., to achieve high adaptability sex, avoid the effect of large deformation

Active Publication Date: 2013-07-03
SHANGHAI JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This is not only costly, but also cannot fundamentally solve the problem of different thermal expansion of the two plates
[0005] Summarizing the above aspects, it can be concluded that the main problem of curing deformation of dissimilar materials is that the overall high-temperature curing is inevitable: the use of low-temperature curing adhesives reduces the strength of the adhesive connection, and the use of adhesives needs to be increased to meet the strength requirements of the body connection. High; external rigid constraints can reduce deformation, but cannot eliminate deformation, and will form a large internal stress inside the part
Therefore, the problem of large deformation of dissimilar materials has become a huge obstacle affecting the development of multi-material lightweight car bodies, which needs to be solved urgently

Method used

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  • Device and method for controlling glue joint curing deformation of dissimilar material
  • Device and method for controlling glue joint curing deformation of dissimilar material
  • Device and method for controlling glue joint curing deformation of dissimilar material

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Embodiment 1

[0028] Such as figure 1 As shown, this embodiment includes: heating and cooling mold 1, high expansion rate parts 2, adhesive layer 3, low expansion rate parts 4, heat insulation accessories 5 and heating mold 6, wherein: heating mold 6, low expansion rate parts 4. The bonding adhesive layer 3 and the heat insulation accessory 5, the high expansion rate part 2 and the heating and cooling mold 1 are stacked in sequence, and the heat insulation accessory 5 and the bonding adhesive layer 3 are located on the same plane; the low expansion rate part 4 is Low carbon steel, its coefficient of thermal expansion is smaller than that of high expansion rate parts 2 aluminum alloy.

[0029] According to the coolant temperature estimation method, the thermal expansion coefficient of aluminum alloy is 23.6e -6 , low carbon steel thermal expansion coefficient 11.3e -6 ~13.5e -6 , the heating temperature is 180°C according to the requirements of the selected adhesive, and the room temperat...

Embodiment 2

[0037] In this embodiment, the low expansion rate part 4 is an aluminum alloy, and its coefficient of thermal expansion is 23.6e -6 , the high expansion rate part 2 is a magnesium alloy, and its thermal expansion coefficient is 27.0e -6 . Low-expansion parts have a lower coefficient of thermal expansion than high-expansion parts.

[0038] The heating temperature is selected at 80°C according to the requirements of the adhesive, the room temperature is 20°C, and the temperature of the corresponding magnesium alloy plate needs to be controlled at about 72°C. Since the temperature difference is not large, the cooling method can be selected as air cooling. Therefore, the described heating and cooling mold 1 is omitted.

[0039] In this embodiment, the cooling temperature step is 1° C., the time step is 1 second, the heating time is 1800 seconds, and the corresponding cooling temperature is 73° C.

[0040] The concrete form of described heating mold 6 is as follows figure 2 A...

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Abstract

The invention relates to a device and method for controlling the glue joint curing deformation of a dissimilar material in the technical field of automobile manufacturing. The method comprises the following steps of: independently controlling metal curing temperatures of parts to be cured at both sides of an adhesive by heating and cooling dies of which the shapes are matched with the shapes of the parts; determining a temperature control strategy of the dies at both sides according to the material properties of the parts to be cured and the adhesive; and clamping the dies and the parts to becured and carrying out dynamic control on the temperature variation of the dies at both sides so as to realize asymmetrical curing of an adhesive layer. According to the invention, the materials at both sides of the adhesive are kept to have the same thermal expansion capacity in the whole adhesive curing process and the directional curing from the high temperature side to the low temperature side of the adhesive layer is realized by utilizing the thermal insulation characteristic of the adhesive and changing the temperature distribution in two plates, so that the aims of controlling and eliminating the gluing deformation are fulfilled.

Description

technical field [0001] The present invention relates to a method and a device in the technical field of automobile manufacturing, in particular to a method and a device for controlling the deformation of dissimilar materials when glued and solidified. Background technique [0002] The pressure of rising oil prices and environmental protection requirements have put forward new requirements for the lightweight of the body. Lightweight alloys such as magnesium, aluminum alloys and composite materials are gradually used in car bodies due to their low density and high specific strength. However, advanced high-strength steel and ultra-high-strength steel will still account for a large proportion of body structural parts due to their excellent mechanical properties and relatively low price advantages. Therefore, the connection of dissimilar materials will be a problem that vehicle body manufacturing must face in the future. Due to the great difference in physical properties betwe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J5/06G05D23/02
Inventor 李永兵林忠钦朱晓搏王培中来新民陈关龙
Owner SHANGHAI JIAOTONG UNIV
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