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Large-heat-radiation-surface LED lighting device and manufacture method thereof

A technology of LED lighting and heat dissipation surface, which is applied to cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., which can solve the problems of unreasonable heat dissipation structure and inability to dissipate heat from LED lamps, etc., and prolong the service life Effect

Inactive Publication Date: 2013-02-13
北京中健创能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing LED lighting equipment, due to the unreasonable design of the heat conduction and heat dissipation structure, it is not possible to quickly and well dissipate the heat generated by the LED lamp during operation.

Method used

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  • Large-heat-radiation-surface LED lighting device and manufacture method thereof
  • Large-heat-radiation-surface LED lighting device and manufacture method thereof
  • Large-heat-radiation-surface LED lighting device and manufacture method thereof

Examples

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Embodiment

[0033] Example: see Figure 1 to Figure 3 , a method for preparing a LED lighting device with a large heat dissipation surface of the present invention, comprising the following steps:

[0034] (1) Prepare a heat dissipation plate 1 with high thermal conductivity metal material, this heat dissipation plate 1 comprises an upper strata plate 11 and the lower stratum plate 12 that send in parallel, the ends of the upper strata plate 11 and the lower stratum plate 12 are connected, the upper strata plate 11 and the lower plate 12 are connected with a number of connection pipes 2 made of high thermal conductivity metal material, the heat dissipation plate 1 is provided with a number of hollow heat dissipation windows 13, the front ends of the upper plate 11 and the lower plate 12 are fixed to a fixed on base 3;

[0035] (2) Prepare several LED lighting assemblies 4, the LED lighting assemblies 4 include a strip shaped heat conducting plate 41 made of high thermal conductivity meta...

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PUM

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Abstract

The invention discloses a manufacture method of a large-heat-radiation-surface LED lighting device, which comprises the following steps of: manufacturing a heat-radiating plate, wherein the heat-radiating plate comprises an upper-layer plate and a lower-layer plate which are arranged in parallel, and a plurality of connecting pipes are connected between the upper-layer plate and the lower-layer plate; manufacturing a plurality of LED lighting assemblies, wherein the LED lighting assemblies are uniformly arranged on the lower surface of the lower-layer plate at intervals; and manufacturing a power supply, and arranging the power supply on the upper surface of the upper-layer plate, wherein the power supply is electrically connected with the LED lighting assemblies, because an LED lamp is sequentially connected with a formed heat-conducting plate and the heat-radiating plate, the heat-radiating plate is of a dual-layer structure comprising the upper-layer plate and the lower-layer plate, the heat-radiating plate is provided with a plurality of hollow heat-radiating windows, so that a large heat-radiating surface is formed, heat generated when the LED lamp works can be rapidly exchanged and radiated, and a stable heat balance state is achieved. The invention also discloses the large-heat-radiation-surface LED lighting device.

Description

technical field [0001] The invention relates to lighting tool manufacturing technology, in particular to a method for preparing an efficient and environment-friendly LED lighting device with a large heat dissipation surface and the LED lighting device with a large heat dissipation surface. Background technique [0002] In modern society, human life is inseparable from light and lighting. In recent years, the country is vigorously promoting LED lighting lamps to respond to the concept of "green and environmental protection" in the world. With the continuous improvement of white LED light efficiency, LED lighting Lamps become a lighting trend. [0003] LED lighting is light-emitting diode lighting. LED is a semiconductor solid light-emitting device. It uses a solid semiconductor chip as a light-emitting material. In the semiconductor, the excess energy is released through the recombination of carriers to cause photon emission, which directly emits red and yellow. , blue, gree...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V29/00F21Y101/02F21V29/503F21V29/70
Inventor 李竹马锋杨金云唐忠林林国华
Owner 北京中健创能科技有限公司