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Adhesive resin composition, laminate using same, and flexible printed wiring board

A technology of resin composition and adhesiveness, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit parts, etc., can solve the problem of inability to obtain adhesive strength, achieve good storage stability, meet flame retardancy, and relatively good capacitive effect

Active Publication Date: 2012-04-11
SUMITOMO ELECTRIC IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, curing may progress gradually during storage and the desired adhesive strength may not be achieved

Method used

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  • Adhesive resin composition, laminate using same, and flexible printed wiring board
  • Adhesive resin composition, laminate using same, and flexible printed wiring board
  • Adhesive resin composition, laminate using same, and flexible printed wiring board

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Experimental program
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Effect test

preparation example Construction

[0076] [Preparation of Adhesive Resin Composition and Adhesive Solution]

[0077] The adhesive resin composition of the present invention is prepared by mixing the above-mentioned components (A) to (D), and the required non-halogen flame retardant and other additives.

[0078] The adhesive resin composition is preferably prepared such that the percentage of phosphorus in the resin composition is 3.1% by mass to 4.5% by mass.

[0079] In addition, curing accelerators, silane coupling agents, leveling agents, defoamers, and other additives may be mixed as needed. However, when using phosphorus-containing epoxy resins and introducing benzo In the case of oxazine compounds, the addition of curing accelerators tends to shorten the pot life of the adhesive and reduce adhesive properties. Therefore, it is not desirable to mix a curing accelerator. In addition, the addition of inorganic fillers tends to reduce adhesive properties and migration characteristics, and therefore, mixin...

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PUM

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Abstract

Disclosed is an adhesive resin composition which contains: an epoxy resin and / or a phenoxy resin; an epoxy-containing copolymer which is obtained by copolymerizing an epoxy-providing monomer and an ethylenically unsaturated monomer that is copolymerizable with the epoxy-providing monomer; a thermoplastic resin; and a curing agent. The epoxy-containing copolymer has a weight average molecular weight of 5,000 or greater but less than 100,000 and an epoxy equivalent of not more than 3,500 g / eq. The adhesive resin composition is capable of providing a one-pack type adhesive solution that is free from halogens and has excellent flame retardancy, excellent compatibility of polymer components, and excellent storage stability. Also disclosed are a laminate using the adhesive resin composition, and a flexible printed wiring board.

Description

technical field [0001] The present invention relates to an adhesive resin composition suitable for use in flexible printed wiring boards such as flexible copper-clad laminates, in particular, to an adhesive resin composition usable as a one-component type resin composition, and using the Flexible printed wiring boards and laminates such as adhesive sheets and cover films of adhesive resin compositions. Background technique [0002] In general, a flexible printed wiring board has a base structure in which a copper foil or the like is bonded with an adhesive to one or both sides of an insulating film composed of a heat-resistant film such as a polyimide film serving as a base material. [0003] As such adhesives used in flexible printed wiring boards, hitherto, adhesive compositions containing thermosetting resins contributing to chemical resistance, heat resistance and mechanical strength have been mainly used Such as epoxy resin, and reactive rubber such as acrylonitrile-bu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00B32B27/38C09J7/02C09J11/06C09J171/10C09J201/06H05K1/03C09J7/35
CPCC08L33/068H05K1/0393C09J7/0203C09J171/02C09J2463/00C09J2477/00C08L71/00H05K3/386C08G2650/56C09J2203/326C08L63/00C09J171/00C09J163/00C09J2471/00C09J7/35C08L2666/02C08L2666/04Y10T428/287C09J7/22C09J7/30B32B27/38H05K1/0313C09J2203/00
Inventor 改森信吾菅原润沟口晃浅井省吾吉坂琢磨上西直太
Owner SUMITOMO ELECTRIC IND LTD
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