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Micronano-scale powder protective layer wrapping device and method

A micro-nano-scale, protective layer technology, applied in coatings, metal material coating processes, gaseous chemical plating, etc., can solve problems such as contact with the surface of powder particles

Active Publication Date: 2013-09-11
江苏迈纳德微纳技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, atomic layer deposition technology was often used to coat large-scale samples, but for micro-nano-scale powder particles, due to their small size, they are easily sucked away by high-speed vacuum pumps in the vacuum chamber, so it is necessary to prevent the particles from being pumped away. protection, but at the same time, it is necessary to solve the problem that the source material of the precursor effectively contacts the surface of the powder particle

Method used

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  • Micronano-scale powder protective layer wrapping device and method
  • Micronano-scale powder protective layer wrapping device and method
  • Micronano-scale powder protective layer wrapping device and method

Examples

Experimental program
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Effect test

Embodiment 1

[0037] Using the above-mentioned device, the micro-nano-scale powder protective layer wrapping device is used as follows:

[0038] Open the external cavity, take out the internal powder reaction device, put the powder to be wrapped and seal the external cavity. Turn on the vacuum pump, open the vacuum opening valve to connect the vacuum chamber with the vacuum pump, and enter the next step when the vacuum reaches the required vacuum degree (less than or equal to 1 pa);

[0039] Set the temperature of the reaction chamber system, equipment piping, and other components. Set the internal temperature of the reaction chamber system to 200°C, set the temperature of the pipeline to 120°C, and the temperature of the pulse actuator to 130°C. When the displayed temperature is consistent with the set Enter the next step when the temperature is the same and stable (the fluctuation range is less than or equal to 1°C);

[0040] Open the manual sealing valve of the precursor cylinder and se...

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Abstract

The invention provides a micronano-scale powder protective layer wrapping device and a micronano-scale powder protective layer wrapping method. The device comprises a vacuum system, a reaction cavity system, a precursor pulse system, a heating system, a carrier gas transmission system and a control system, wherein the precursor pulse system is connected with the reaction cavity system; the reaction cavity system is connected with the vacuum system; a connecting channel of the precursor pulse system and the reaction cavity system is connected with the carrier gas transmission system; and the heating system comprises heating devices arranged on the system devices. The micronano-scale powder protective layer wrapping method comprises the following steps of: wrapping the micronano-scale powder in the vacuum reaction cavity by using a protective layer and an atomic layer deposition (ALD) technology at a certain temperature; allowing a precursor source material to enter the reaction cavity system through carrier gas alternation by using a pulse actuator, wherein a micro-scale hole is formed on the end face of the inner cavity accommodating the powder; and cleaning the redundant precursor source material and reaction byproducts by using the carrier gas so as to obtain the required micronano-scale powder wrapped by the protective layer.

Description

technical field [0001] The invention relates to a micro-nano-scale powder protective layer wrapping device and method, and belongs to the field of powder deposition devices and technologies. Background technique [0002] Due to the small particle size and many surface bonds, micro-nano-scale powders often exhibit excellent characteristics different from bulk materials, but at the same time, they also have a series of disadvantages such as easy agglomeration, easy oxidation, and unstable properties. The method of wrapping the protective layer on the surface of nano-scale powder has become an important method to solve the series of shortcomings of micro-nano-scale powder. Coating a chemically inert protective layer on the surface of the powder can not only increase the stability of the nanoparticles, but also make the coated micro-nano-scale powder particles have certain functional types. However, the protective layer formed by ordinary micro-nano powder encapsulation methods...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/44C23C16/455
Inventor 左雪芹梅永丰
Owner 江苏迈纳德微纳技术有限公司
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