Memory liquid-cooling heat dissipation method and device as well as system

A heat dissipation device and memory liquid technology, applied in the computer field, can solve problems such as inconvenient maintenance and high risk of coolant leakage, and achieve the effects of easy plugging and unplugging and reducing the risk of leakage

Active Publication Date: 2012-04-18
XFUSION DIGITAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The memory liquid cooling module in the prior art is directly fixed on the memory, and the liquid cooling module must be removed when maintaining the memory, which is inconvenient for maintenance, and when the liquid cooling module is removed, there is a greater risk of coolant leakage

Method used

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  • Memory liquid-cooling heat dissipation method and device as well as system
  • Memory liquid-cooling heat dissipation method and device as well as system
  • Memory liquid-cooling heat dissipation method and device as well as system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1. Embodiment 1 of the present invention provides a memory liquid cooling device for dissipating heat from memory. figure 2 Shown is the overall structural diagram of the memory liquid cooling device provided in Embodiment 1 of the present invention, according to figure 2 , the cooling device includes a liquid inlet pipe 20 , a connecting pipe 21 , a liquid outlet pipe 23 , a mainboard 10 , and a liquid cooling block 22 and a memory slot 27 arranged on the mainboard 10 . The liquid cooling block 22 is adjacent to the memory slot 27 , so that after the memory module is inserted into the memory slot 27 , it can be in close contact with the liquid cooling block 22 , thereby transferring heat to the liquid cooling block 22 .

[0023] In one embodiment, the liquid cooling block 22 is located on a different plane from the mainboard 10 and is connected to one side of the mainboard 10 . Specifically, such as figure 2 As shown, the plane where the liquid cooling ...

Embodiment 2

[0035] Embodiment 2, Embodiment 2 of the present invention provides a memory liquid cooling system, such as Figure 5 As shown, the system includes a memory liquid cooling device 32 and at least one memory stick (such as Figure 5 30 in), there are some memory particles on both sides of the memory stick 30 (for example Figure 5 31); the memory liquid cooling heat dissipation device 32 is composed of a liquid inlet pipe 20, a connecting pipe 21, a liquid cooling block 22, a liquid outlet pipe 23 and a main board 10, wherein the structure of the liquid cooling block 22 is as follows image 3 shown, according to image 3 , the liquid cooling block 22 is mainly composed of a metal block 25, metal shrapnel 24 installed on both sides of the metal block, and a liquid channel 26 passing through the metal block 25; the liquid cooling block 22 is fixed on the main board 10, and the liquid inlet pipe 20 and the liquid outlet The pipe 23 is installed on both sides of the liquid cooling...

Embodiment 3

[0038] Embodiment 3. Embodiment 3 of the present invention provides a memory liquid cooling method for dissipating heat from a memory inserted in a memory slot of a motherboard, such as Image 6 As shown, the method mainly includes:

[0039] Step 601, setting a liquid cooling block on the motherboard adjacent to the memory slot, the liquid cooling block is composed of a metal block, metal shrapnel fixed on both sides of the metal block, and a liquid channel passing through the metal block ;

[0040] Step 602, using the metal shrapnel to conduct the heat generated by the memory stick inserted in the memory slot to the metal block;

[0041] Step 603, setting a liquid inlet pipe and a liquid outlet pipe on the main board, and using a connecting pipe to connect the liquid inlet pipe, the liquid outlet pipe and the liquid channel to form a cooling liquid circuit;

[0042] Step 604 , the cooling liquid in the cooling liquid circuit absorbs the heat conducted from the memory stick ...

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PUM

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Abstract

The embodiment of the invention provides a memory liquid-cooling heat dissipation device which comprises a liquid inlet pipe, a connecting pipe, a liquid-cooling block, a liquid outlet pipe and a mainboard, wherein the liquid inlet pipe, the liquid outlet pipe and the liquid-cooling block are fixed on the mainboard; the liquid inlet pipe and the liquid outlet pipe are respectively positioned at two ends of the liquid-cooling block; a memory slot is also arranged on the mainboard and is close to the liquid-cooling block; the liquid-cooling block is composed of a metal block, metal domes arranged at two sides of the metal block and a liquid passageway penetrated through the metal block; the liquid inlet pipe, the liquid passageway inside the metal block and the liquid outlet pipe are communicated by the connecting pipe to form a cooling liquid loop; correspondingly, the embodiment of the invention also provides a memory liquid-cooling heat dissipation method and system; according to the technical scheme, the heat dissipation on the memory is realized; meanwhile, as the liquid-cooling block is in contact with a memory bank only through the metal domes, the memory bank can be very convenient to insert and pull out without dismantling the liquid-cooling block when the memory bank is maintained, thereby the risk caused by cooling liquid leakage is reduced.

Description

technical field [0001] The present invention relates to the field of computers, in particular to a memory liquid cooling method, device and system. Background technique [0002] In order to deal with the rapidly increasing amount of information, servers and minicomputers must continuously improve their computing performance, requiring more components with faster computing speeds, which makes the system heat increase rapidly, and at the same time, due to servers and minicomputers The volume of the machine is limited, and the layout of components is relatively compact, so the heat consumption density of the system increases sharply. At present, the heat dissipation of the system has become the main bottleneck restricting the performance improvement of servers and minicomputers, and the traditional air-cooling method has reached the point where it is difficult to deal with this problem. The main heat dissipation method of the minicomputer. [0003] As a key component of serve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCH01L23/40H01L23/473G06F1/20G06F2200/201H01L2924/0002H01L2924/00
Inventor 杨成鹏彭耀锋
Owner XFUSION DIGITAL TECH CO LTD
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