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Epoxy resin and silicon resin cured coating and package removing agent and preparation method thereof

A technology of epoxy resin and silicone resin, which is applied in the direction of epoxy resin coating, chemical coating/ink remover, coating, etc., can solve the problems of no peeling and removal methods, etc., and achieve wide use temperature range and low volatility Sexuality and low cost effect

Active Publication Date: 2012-05-02
TECORE SYNCHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, there is no effective means for silicone resin peeling and removal.
[0007] In addition, epoxy hybrid silicone resin is also a frequently used material for LED packaging. The cured epoxy hybrid silicone resin has stable performance and strong resistance to organic solvents. At present, there is no safe and effective peeling and removal method.

Method used

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  • Epoxy resin and silicon resin cured coating and package removing agent and preparation method thereof
  • Epoxy resin and silicon resin cured coating and package removing agent and preparation method thereof
  • Epoxy resin and silicon resin cured coating and package removing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 21

[0050] The preparation method of the remover of epoxy resin and silicone resin cured coating and encapsulation, comprises the steps:

[0051] (1) get each raw material of embodiment 1;

[0052] (2) Mix and stir the raw materials in step (1) evenly to make epoxy resin and silicone resin cured coating and encapsulation remover.

[0053] The raw materials of Examples 2-20 can be prepared by the method of Example 21 into epoxy resin and silicone resin cured coatings and encapsulation removers.

[0054] The said silicone resin of the present invention, its scientific name is polysiloxane resin.

[0055] Remove effect:

experiment example 1

[0057] Immerse the electronic component that needs to remove the cured epoxy resin in the container containing the remover prepared by the formula in Example 20, seal it, and heat it to 50 ° C. When it is observed that the cured epoxy resin has been removed from the electronic component , Take out the electronic components with clips and rinse with water.

experiment example 2

[0059] Take about 100ml of remover (prepared by the formula in Example 9) and put it into a beaker, heat it to 110°C, put it into a silicone rubber (Dow Corning OE-6630, OE-6250) LED sample ( figure 1 middle figure 1 -A), and turn on the stirring, process for 20 minutes, take out the silicone rubber LED sample, rinse it with clean water, the silicone rubber has been partially dissolved (such as figure 1 -B). After the sample was continuously processed for 25 minutes, it was taken out and rinsed with clear water, and the silicone rubber was completely dissolved and peeled off (such as figure 1 -C). It shows that the remover has a good peeling effect on the cured silicone rubber, but the gold wire is intact, the chip is intact, and the substrate has no corrosion.

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Abstract

The invention discloses an epoxy resin and silicon resin cured coating and package removing agent, which consists of a component A, a component B, a component C, water and an inorganic strong alkali, wherein the component A may be at least one of aliphatic monohydric alcohol, aliphatic dihydric alcohol, aliphatic dihydric alcohol condensation product, ether formed by aliphatic dihydric alcohol and aliphatic monohydric alcohol, aliphatic trihydric alcohol and aliphatic ether of aliphatic trihydric alcohol; the component B may be at least one of pyrrolidone compound and / or 1,3-dimethyl imidazolidinone; and the component C may be at least one of monobenzyl ether of aliphatic dihydric alcohol, monobenzyl ether of aliphatic trihydric alcohol and diphenyl ether of aliphatic trihydric alcohol. When the removing agent disclosed by the invention is used, cured epoxy resin and organic silicon resin on the surface of an object can be dissolved and removed, the removal is quick and complete, and the surface of the substrate such as electronic element and circuit board can be protected from any damage; and the removing agent can be repeatedly used. The removing agent disclosed by the inventionis low in toxicity and volatility, the use temperature range is wide, the cost is low, and the removing agent is environment-friendly.

Description

technical field [0001] The invention relates to a remover for epoxy resin and silicone resin cured coating and encapsulation and a preparation method. Background technique [0002] Epoxy resins are widely used in electronic packaging, protective coatings, and device bonding. Epoxy resins contain active epoxy groups. Under the action of catalysts and curing agents, epoxy resins can undergo crosslinking reactions with curing agents to form insoluble and infusible high polymers with three-dimensional network structures, so Once the epoxy adhesive or epoxy coating has cured, it becomes very difficult to remove. However, in the application of epoxy resin in the field of microelectronics, it is often necessary to take out the failure or some original components and reprocess them, or when recycling electronic devices, this requires the complete removal of the epoxy resin encapsulation layer or coating, Without any damage to electronic devices or underlying components. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D9/00C09D163/00C09D183/04
Inventor 谭晓华冯亚凯
Owner TECORE SYNCHEM
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