Laser processing device, processing method and dividing method for processed object
A technology for processing objects and laser processing, which is applied in the direction of fine work equipment, stone processing equipment, laser welding equipment, etc.
Inactive Publication Date: 2012-05-16
MITSUBOSHI DIAMOND IND CO LTD
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[0005] For example, when the repetition frequency (unit kHz), which is the most basic parameter of laser processing, is R, and the scanning speed (unit mm / sec) is V, the ratio V / R of the two becomes the center interval of the beam spot, but In the techniques disclosed in Patent Document 1 and Patent Document 2, laser beam irradiation and scanning are performed under the condition that V / R is 1 μm or less so that beam spots overlap each other
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[0084]
[0085] First, the principle of processing realized in the embodiment of the present invention shown below will be described. The processing performed in the present invention is roughly described as follows: while scanning pulsed laser light (hereinafter also simply referred to as laser light), the pulsed laser light is irradiated to the upper surface (processed surface) of the workpiece, In this way, the workpiece is sequentially cleaved or split between the irradiated areas of each pulse, and the starting point for division is formed as a continuous surface of the cleavage plane or the cleave plane formed on each ( start of division).
[0086] In addition, in the present embodiment, cleavage refers to a phenomenon in which a workpiece is fractured substantially regularly along a crystal plane other than a cleavage plane, and this crystal plane is called a cleavage plane. In addition, in addition to cleavage or cracking, which are microscopic phenomena that comple...
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The present invention relates to a laser processing device, a processing method and a dividing method for processed object. An optical path between a light source and a carrier is branched to a first optical path part and a second optical path part in midway, wherein the light source transmits out pulse laser with psec-grade pulse width. The length of the second optical path is set for each unit pulse light according to a mode that the second semi-pulse light that advances in the second optical path is delayed from the first semi-pulse light that advances in the first optical path. Furthermore the pulse light is irradiated through a mode that the irradiation area of the first semi-pulse light is same with that of the second semi-pulse light and the irradiation area of each unit pulse light is discretely formed on a processed surface, thereby causing the processed object to split or crack between the irradiation areas and forming a staring point for dividing on the processed object.
Description
technical field [0001] The present invention relates to a laser processing method for processing a workpiece by irradiating laser light, and a laser processing device used in the method. Background technique [0002] Various techniques are known for processing a workpiece by irradiating pulsed laser light (hereinafter, simply referred to as laser processing or laser processing technology) (for example, refer to Patent Document 1 to Patent Document 4). [0003] Patent Document 1 discloses a method in which, when dividing a chip as a workpiece, a groove (cutting groove) having a V-shaped cross section is formed along a planned dividing line by laser ablation, and the chip is cut from the groove as a starting point. to split. On the other hand, Patent Document 2 discloses a method of irradiating a laser light in a defocused state along the planned division line of the workpiece (divided body), so that the crystalline state in the irradiated region is damaged compared with the ...
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IPC IPC(8): B23K26/36B23K26/08B23K26/42B23K26/00B23K26/38B28D5/00
Inventor 长友正平中谷郁祥菅田充
Owner MITSUBOSHI DIAMOND IND CO LTD