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Resin composition, and prepreg and printed circuit board made from same

A resin composition and technology of the composition, applied in the directions of printed circuit parts, circuit substrate materials, layered products, etc., can solve the problems of different product properties, difficult to control quality, and difficult to master the degree of polymerization.

Inactive Publication Date: 2012-05-16
TAIWAN POWDER TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in this method, the ring-opening polymerization reaction of the nitrogen-oxygen heterocyclic compound and the polymerization reaction with the epoxy resin are carried out simultaneously, so the degree of polymerization is difficult to grasp, and it is easy to cause problems such as different properties of each batch of products and difficult quality control.

Method used

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  • Resin composition, and prepreg and printed circuit board made from same
  • Resin composition, and prepreg and printed circuit board made from same
  • Resin composition, and prepreg and printed circuit board made from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] As shown in the ratio of Table 1, 100 parts by weight of DOPO epoxy resin (Kolon5138), 0.5 parts by weight of 2-methylimidazole, 0.5 parts by weight of epoxy silane coupling agent (Shin-Etsu Chemical, KBM-403), 20 parts by weight of phosphazene flame retardant (Otsuka Chemical, SBP-100), 50 parts by weight of talc and 80 parts by weight of polymer solution 1-1 (in terms of solids), use a stirrer to mix at room temperature for 60 Minutes, then add the butanone of 80 weight parts again. After the above mixture was stirred at room temperature for 120 minutes, resin composition 1 was obtained.

Embodiment 2

[0105] Resin composition 2 was prepared in the same manner as in Example 1, except that 80 parts by weight of polymer solution 1-2 (calculated as solids) was used instead of polymer solution 1-1 as the hardener, as shown in Table 1.

Embodiment 3

[0107] Resin composition 3 was prepared in the same manner as in Example 1, except that 80 parts by weight of polymer solution 1-3 (calculated as solids) was used instead of polymer solution 1-1 as the hardener, as shown in Table 1.

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Abstract

The invention relates to a resin composition which comprises an epoxy resin and a polymer solution used as a hardener. The resin composition is prepared by the following steps: (a) dissolving a nitrogen oxygen heterocyclic compound in a first solvent to form a first reaction solution, wherein the nitrogen oxygen heterocyclic compound is disclosed as Formula I or II, and R1 to R3, W1, W2, m, n, p and q are defined in the specification; (b) heating the first reaction solution to a first temperature to carry out ring-opening polymerization reaction; and (c) cooling the first reaction solution to a second temperature to substantially end the ring-opening polymerization reaction, thereby obtaining the polymer solution, wherein the first solvent does not react with the nitrogen oxygen heterocyclic compound, the first temperature is higher than the softening temperature of the nitrogen oxygen heterocyclic compound and lower than the boiling point of the first solvent, the second temperature is lower than the first temperature, and on solid basis, every 100 parts by weight of epoxy resin requires 20-200 parts by weight of epoxy resin.

Description

technical field [0001] The present invention relates to a kind of resin composition; In particular, the present invention relates to a kind of epoxy resin composition that is made of a polymer solution made of a nitrogen-oxygen heterocyclic compound as a hardening agent and made thereof Prepreg and printed circuit board. Background technique [0002] A printed circuit board is a circuit substrate of an electronic device, which carries other electronic components and electrically connects these components to provide a stable circuit working environment. The common printed circuit board substrate is copper clad laminate (CCL), which is mainly composed of resin, reinforcing material and copper foil. Common resins such as epoxy resin, phenolic resin, polyester Amine formaldehyde, silicone and Teflon, etc., and commonly used reinforcing materials such as glass fiber cloth, glass fiber mat, insulating paper, linen, etc. [0003] Generally speaking, printed circuit boards can be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08L63/00C08J5/24H05K1/03B32B15/092
Inventor 廖世灏廖志伟徐玄浩陈宪德林宗贤
Owner TAIWAN POWDER TECH CO LTD
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