Heat conducting plate and method for preparing same
A heat-conducting plate and heat-conducting substrate technology, applied in lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of easy deformation, large thickness, poor heat-conducting efficiency of heat-conducting plate, etc. The effect of improving thermal conductivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0034] The present invention also provides a method for preparing a heat conducting plate, the steps of which are as follows:
[0035] (1) Grooving: making capillary grooves on the inner surface of the upper heat-conducting substrate and / or the lower heat-conducting substrate;
[0036] (2) bonding and welding: bonding and welding the inner surfaces of the upper and lower heat-conducting substrates obtained in step (1) to form a composite board;
[0037] (3) Half-sealing: welding and sealing one end face of the composite board to form a sealed end; the other end face of the composite board forms an unsealed end;
[0038] (4) Liquid injection and vacuuming: inject working fluid from the unsealed end and vacuumize, or inject working fluid after first vacuumizing;
[0039] (5) Sealing: welding and sealing the unsealed end.
[0040] Among them, the bonding welding is preferably realized by means of thermal diffusion welding.
Embodiment 1
[0043] refer to figure 1 shown. A heat conduction plate, comprising an upper heat conduction substrate 22 , a lower heat conduction substrate 21 and a working fluid (not shown in the figure) enclosed in the upper heat conduction substrate 22 and the lower heat conduction substrate 21 .
[0044] The upper and lower heat conduction substrates 22 and 21 are both copper plates with a thickness of 4mm, and have an inner surface and an outer surface.
[0045] Capillary grooves 23 are arranged on the inner surface of the lower heat-conducting substrate 21 , and the capillary grooves 23 are distributed parallel to each other. The cross-sectional shape of the capillary groove 23 is V-shaped. The capillary groove 23 has a width of 100 μm. The inner surface of the upper heat conduction substrate 22 is a smooth surface without capillary grooves.
[0046] Wherein, the inner surface of the upper heat conduction substrate 22 covers the inner surface of the lower heat conduction substrate...
Embodiment 2
[0049] refer to figure 2 shown. A heat conduction plate, comprising an upper heat conduction substrate 22 , a lower heat conduction substrate 21 and a working fluid (not shown in the figure) enclosed in the upper heat conduction substrate 22 and the lower heat conduction substrate 21 .
[0050] The upper and lower heat conduction substrates 22 and 21 are both copper plates with a thickness of 4mm, and have an inner surface and an outer surface.
[0051] Capillary grooves 23 are arranged on the inner surfaces of the upper and lower heat-conducting substrates 22 and 21 , and the capillary grooves 23 are distributed parallel to each other. The cross-sectional shape of the capillary groove 23 is V-shaped. The width of the capillary groove 23 is 100 μm, wherein, the inner surface of the upper heat conduction substrate 22 covers the inner surface of the lower heat conduction substrate 21, and the upper and lower heat conduction substrates 22, 21 are in contact with each other by ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More