Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof

Abstract

The invention discloses a heat-conducting double-faced soft and hard combined base plate, which comprises copper foil layers, aluminum plates, insulated heat-conducting polymer layers, and bonding layers. The insulated heat-conducting polymer layers are fixedly pasted at the two sides of the bonding layers. The copper foil layers are fixedly pasted on two outer side surfaces of the insulated heat-conducting polymer layers. The aluminum plates are fixedly arranged in the inner parts of the bonding layers. The surface areas of the aluminum plates are smaller than that of the bonding layers. The insulated heat-conducting polymer layers comprise a solid material and a heat radiating powder body. The bonding layers comprise a resin layer and a heat radiating powder body. A manufacturing method for the heat-conducting double-faced soft and hard combined base plate comprises the steps of: coating the insulated heat-conducting polymers on the rough surfaces of the copper foil layers, and drying; next, forming the bonding layers onto the surfaces of the insulated heat-conducting polymer layers by using one of coating and transfer printing methods, and enabling the bonding layers to be in semi-polymerizing and semi-hardening states; then, pasting the bonding layers with single-faced copper foil base plates at the two sides of the aluminum plates, directly pasting the parts without the aluminum plates between the two bonding layers; finally, heating and curing. The heat-conducting double-faced soft and hard combined base plate disclosed by the invention is high in heat radiating efficiency, insulated and resistant to voltage breakdown, and is capable of solving the troubles of line designs of different planes.

Description

technical field [0001] The invention relates to a heat-conducting substrate used on heat-dissipating products such as LEDs and a manufacturing method thereof, in particular to a heat-conducting double-sided flexible-rigid bonding substrate with high heat dissipation efficiency and a manufacturing method thereof. Background technique [0002] With the rise of global awareness of environmental protection, energy saving and power saving has become a trend today. The LED industry is one of the most watched industries in recent years. Up to now, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, no mercury, and environmental protection benefits. However, usually about 20% of the input power of LED high-power products can be converted into light, and the remaining 80% of the electrical energy is converted into heat energy. [0003] Generally speaking, if the heat energy generated when the LED emits light cannot ...

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Problems solved by technology

[0003] Generally speaking, if the heat energy generated when the LED emits light cannot be exported, the junction temperature of the LED will be too high, which will affect the product life cycle, luminous efficiency, and stability.

[0004] Secondly, when designing circuits, due to the need for heat-dissipating metal materials, such as aluminum plates, the material is relatively hard and does not have the function of flexing, which limits the scope of circuit design and cannot design products with different planes

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