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Epoxy adhesive with high bonding strength

An epoxy adhesive, strength technology, applied in the field of adhesives, can solve problems such as free volume increase

Inactive Publication Date: 2012-05-30
SHANGHAI ENYI MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the free volume of the encapsulation material also increases, leading to an increase in water absorption

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Component A: 51 parts of glyceride epoxy resin, 52 parts of bisphenol B epoxy resin, 6 parts of trimethylolpropane-propylene oxide polyether triol, 110 parts of bisphenol fluorene epoxy resin,

[0029] Component B raw materials: 22 parts of polyphenyl polymethylene polyisocyanate, 42 parts of diamine fluorene, 22 parts of trimethylolpropane-oxypropylene polyether triol.

[0030] Mix component A uniformly at 100°C in advance, add component B, and stir at 100°C for 20 minutes to make a liquid adhesive. curing to obtain the epoxy adhesive with high bonding strength.

Embodiment 2

[0032] Component A: 55 parts of glyceride epoxy resin, 58 parts of bisphenol B epoxy resin, 7 parts of trimethylolpropane-propylene oxide polyether triol, 105 parts of bisphenol fluorene epoxy resin,

[0033] Raw materials of component B: 25 parts of polyphenyl polymethylene polyisocyanate, 42 parts of diamine fluorene, and 26 parts of trimethylolpropane-oxypropylene polyether triol.

[0034] Mix component A uniformly at 100°C in advance, add component B, and stir at 100°C for 20 minutes to make a liquid adhesive. curing to obtain the epoxy adhesive with high bonding strength.

Embodiment 3

[0036] Component A: 55 parts of glyceride epoxy resin, 58 parts of bisphenol B epoxy resin, 9 parts of trimethylolpropane-oxypropylene polyether triol, 115 parts of bisphenol fluorene epoxy resin,

[0037] Component B raw materials: 27 parts of polyphenyl polymethylene polyisocyanate, 48 parts of diamine fluorene, 28 parts of trimethylolpropane-oxypropylene polyether triol.

[0038] Mix component A uniformly at 100°C in advance, add component B, and stir at 100°C for 20 minutes to make a liquid adhesive. curing to obtain the epoxy adhesive with high bonding strength.

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PUM

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Abstract

The invention relates to an epoxy adhesive with high bonding strength. The epoxy adhesive is prepared by the following raw materials of: by weight, a raw material component A consisting of 50-60 parts of glyceride epoxy resin, 50-60 parts of bisphenol B epoxy resin, 5-10 parts of trimethylol propane-propylene oxide polyethertriol, 100-120 parts of bisphenol fluorine epoxy resin; and a raw material component B consisting of 20-40 parts of PAPI, 40-50 parts of 9,9-bis(4-aminophenyl)fluorine and 20-30 parts of trimethylol propane-propylene oxide polyethertriol. The epoxy adhesive provided by the invention has high bonding strength and can be used for the packaging of thin-type electronic products.

Description

technical field [0001] The invention relates to an adhesive, which belongs to the field of adhesives, in particular to an epoxy adhesive with high bonding strength. Background technique [0002] With the rapid development of high-density mounting technology in the electronic field, more and more thin packages are used. However, when this thin packaged device is mounted on a printed circuit board, the whole package must be dipped in a tin bath. This soldering process must withstand a high temperature of more than 200°C, and the packaging material must have high heat resistance and high heat resistance. of bond strength. [0003] Epoxy resin has good heat resistance and dimensional stability, bonding performance, electrical insulation performance and chemical corrosion resistance, while general-purpose epoxy resin, after being cured with a general-purpose curing agent, has high cross-linking density, large internal stress, and toughness. Poor, and because of the high concent...

Claims

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Application Information

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IPC IPC(8): C09J175/04C09J175/08
Inventor 许梅芳
Owner SHANGHAI ENYI MATERIAL TECH
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