Method for cleaning silicon wafer
A technology for cleaning silicon wafers and silicon wafers, which is applied to cleaning methods and appliances, chemical instruments and methods, electrical components, etc., can solve problems such as uneven dispersion of ultrasonic waves, limited cleaning cleanliness, and uneven cleaning of silicon wafers. Cleaning effect, low cost, effect of ensuring cleanliness
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Embodiment 1
[0025] A method for cleaning silicon wafers, comprising the steps of:
[0026] A. Rough cleaning: Put the silicon wafer into the silicon wafer cleaning basket, immerse the cleaning basket containing the silicon wafer in deionized water and perform rough cleaning under the action of ultrasonic waves; the ultrasonic frequency is 80KHz, and the rough cleaning time is 15 minutes;
[0027] B. Soaking: Soak the rough-washed silicon chip in citric acid at room temperature, the mass percent concentration of citric acid is 10%, and the soaking time is 30 minutes; then soak in kerosene for 20 minutes;
[0028] C. Cleaning: The soaked silicon wafer is immersed in deionized water for cleaning; the deionized water contains fluff particles, and the content of fluff particles is 20%, calculated by volume ratio; during the cleaning process, the silicon wafer is rotated in deionized water, The silicon wafer is rotated at a speed of 20r / min and rotated for 2 minutes; then reversed, the silicon ...
Embodiment 2
[0031] A method for cleaning silicon wafers, comprising the steps of:
[0032] A. Rough cleaning: Put the silicon wafer into the silicon wafer cleaning basket, immerse the cleaning basket containing the silicon wafer in deionized water and perform rough cleaning under the action of ultrasonic waves; the ultrasonic frequency is 80KHz, and the rough cleaning time is 15 minutes;
[0033] B. Soaking: Soak the rough-washed silicon chip in citric acid at room temperature, the mass percent concentration of citric acid is 10%, and the soaking time is 30 minutes; then soak in kerosene for 20 minutes;
[0034] C. Cleaning: The soaked silicon wafer is immersed in deionized water for cleaning; the deionized water contains fluff particles, and the content of fluff particles is 20%, calculated by volume ratio; during the cleaning process, the silicon wafer is rotated in deionized water, The silicon wafer rotates at a speed of 20r / min and rotates for 2 minutes; rotates in the other direction...
Embodiment 3
[0037] A method for cleaning silicon wafers, comprising the steps of:
[0038] A. Rough cleaning: Put the silicon wafer into the silicon wafer cleaning basket, immerse the cleaning basket containing the silicon wafer in deionized water and perform rough cleaning under the action of ultrasonic waves; the ultrasonic frequency is 80KHz, and the rough cleaning time is 15 minutes;
[0039] B. Soaking: Soak the rough-washed silicon chip in citric acid at room temperature, the mass percent concentration of citric acid is 10%, and the soaking time is 30 minutes; then soak in kerosene for 20 minutes;
[0040] C. Cleaning: The soaked silicon wafer is immersed in deionized water for cleaning; the deionized water contains fluff particles, and the content of fluff particles is 20%, calculated by volume ratio; during the cleaning process, the silicon wafer is rotated in deionized water, The silicon wafer rotates at a speed of 20r / min and rotates for 2 minutes; in the second direction, the s...
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