A method for preparing silicon nanowires on a single crystal silicon substrate

A technology of silicon nanowires and single crystal silicon is applied in the field of preparing silicon nanowires on a single crystal silicon substrate, which can solve the problem of high cost and achieve the effects of easy production, low cost and wide application prospect.

Active Publication Date: 2016-03-09
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a method for preparing silicon nanowires on a single crystal silicon substrate, so as to solve the problem of high cost of preparing silicon nanowires based on SOI substrates in the prior art

Method used

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  • A method for preparing silicon nanowires on a single crystal silicon substrate
  • A method for preparing silicon nanowires on a single crystal silicon substrate
  • A method for preparing silicon nanowires on a single crystal silicon substrate

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Embodiment 1

[0052] Please refer to Figure 2a-2c , Figure 3a-3g and Figure 4 ,in, Figure 2a is a schematic top view of the first mask used in the method for preparing silicon nanowires on a single crystal silicon substrate according to Embodiment 1 of the present invention; Figure 2b is a schematic top view of the second mask used in the method for preparing silicon nanowires on a single crystal silicon substrate according to Embodiment 1 of the present invention; Figure 2c It is a schematic diagram of registration with the first mask when the second mask is used in the method for preparing silicon nanowires on a single crystal silicon substrate according to Embodiment 1 of the present invention; Figure 3a-3g It is the method for preparing silicon nanowires on a single crystal silicon substrate according to Embodiment 1 of the present invention. Figure 2c Schematic diagram of the cross-sectional process in the direction indicated by AA' in the middle; Figure 4 It is the metho...

Embodiment 2

[0065] Please refer to Figures 5a-5c and Image 6 ,in, Figure 5a is a schematic top view of the first mask used in the method for preparing silicon nanowires on a single crystal silicon substrate according to Embodiment 2 of the present invention; Figure 5b is a schematic top view of the second mask used in the method for preparing silicon nanowires on a single crystal silicon substrate according to Embodiment 2 of the present invention; Figure 5c It is a schematic diagram of registration with the first mask when the second mask is used in the method for preparing silicon nanowires on a single crystal silicon substrate according to Embodiment 2 of the present invention; Image 6 It is the method for preparing silicon nanowires on a single crystal silicon substrate according to the second embodiment of the present invention. Figure 5c The schematic cross-sectional view in the direction indicated by AA'.

[0066] The difference between this embodiment and Embodiment 1 i...

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Abstract

The invention provides a method of preparing a silicon nanowire on a monocrystalline silicon substrate. The method comprises the following steps: providing the monocrystalline silicon substrate; forming a first silicon dioxide layer, a silicon nitride layer and a second silicon dioxide layer on the monocrystalline silicon substrate in order; utilizing a first mask plate to carry out photoetching and definition on an active region, etching and removing the second silicon dioxide layer, the silicon nitride layer and the first silicon dioxide layer of the active region, and exposing the monocrystalline silicon substrate of the active region; etching transversely and removing part of the silicon nitride layer to form a groove; carrying out epitaxial growth of a silicon layer on the exposed monocrystalline silicon substrate, wherein the silicon layer fills out the groove; utilizing the first mask plate to carry out photoetching and definition on a silicon nanowire support area, etching the silicon layer, and forming the silicon nanowire in the groove; and etching and removing the second silicon dioxide layer, the silicon nitride layer and the first silicon dioxide layer apart from the active region so as to hang the silicon nanowire. The preparation method of the invention is simple and controllable, and production cost is low.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a method for preparing silicon nanowires on a single crystal silicon substrate. Background technique [0002] In recent years, with the continuous exploration and research in the field of nanotechnology, materials with one-dimensional nanostructures, such as silicon nanowires, have attracted more and more attention. Silicon nanowires have significant quantum effects, large specific surface area and other characteristics, and have good application prospects in MOS devices, sensors and other fields. How to prepare silicon nanowires in a simple, controllable and low-cost way has become an important topic. [0003] The preparation methods of silicon nanowires can be mainly divided into two categories: "bottom-up" and "top-down". The bottom-up approach mainly relies on nanotechnology, using catalysts to catalyze the growth of nanowires. Although this method...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02B82Y40/00
Inventor 范春晖
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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