Spray head

Abstract

The invention provides a spray head which comprises a spray head matrix. A silicon or silicon carbide layer is covered on the spray head matrix, wherein an yttrium oxide layer is covered on the surface of the silicon or silicon carbide layer. The spray head provided by the invention has strong etching resistance capability and long service life.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a shower head. Background technique [0002] In recent years, in the field of semiconductor manufacturing, shower heads for supplying air in a shower-like manner to substrates such as semiconductor wafers have been used. For example, in plasma etching processing equipment, a mounting table for mounting a substrate is provided in the processing chamber, and a shower head is provided at a position opposite to the mounting table, and a plurality of gas ejection holes are provided on the surface of the shower head. , to generate plasma by supplying gas in a shower. In the above-mentioned plasma processing apparatus, since plasma is generated in the processing chamber, the temperature of the showerhead is generally high. [0003] The substrate of the existing shower head is generally aluminum, but aluminum is easily corroded in the plasma environment, resulting in a short ...

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Problems solved by technology

[0003] The substrate of the existing shower head is generally aluminum, but aluminum is easily corroded in the plasma environment, resulting in a short service life of the shower head

In response to this problem, in the prior art, the outer surface of the substrate is covered with a layer of aluminum oxide (Al 2 o 3 ), however, because the surface of the shower head is in contact with the plasma when it is in use, and the surface of the alumina is easy to react with the fluorine-containing plasma to form aluminum fluoride particles, which gradually accumulate to form large particles, which fall on the waiting surface Etching the wafer will cause pollution, so alumina is not the preferred material for the shower head cover layer. The industry is gradually being replaced by silicon, which is less prone to particle pollution and has better heat dissipation performance (thermal conductivity: 149Wm -1 K -1 ) or silicon carbide (thermal conductivity: 150Wm -1 K -1 ) overlay replaced by

[0004] However, the inventors found that after using the shower head with the silicon or silicon carbide covering layer for a period of time, due to plasma etching, silicon or silicon carbide will react with the etching gas, and the thickness of the shower head will gradually change. Thin, the gas ejection hole gradually becomes larger, etc. Therefore, the industry is in urgent need of a shower head with stronger etching resistance.

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