Packaging method for high-efficiency vertical coupling interconnection of optical fiber and optical waveguide chip

Abstract

The invention discloses a packaging method for high-efficiency vertical coupling interconnection of optical fiber and optical waveguide chip which comprises the following steps of: preparing a silica-based nano waveguide grating and scanning the silica-based nano waveguide grating by applying a scanning electron microscope; preparing a curing packaging material with a low refractive index; preparing a monomode optical fiber; coating an optical anti-reflection film on the surface of the silica-based nano waveguide grating; regulating the position between the monomode optical fiber and the silica-based nano waveguide grating; dispensing an adhesive at the coupling ends of the monomode optical fiber and the silica-based nano waveguide grating; exposing and curing an inner packaged body subjected to adhesive dispensing; preparing a V-shaped optical fiber positioning groove; placing the monomode optical fiber in the V-shaped optical fiber positioning groove; carrying out curing packaging on the monomode optical fiber; exposing and curing the V-shaped optical fiber positioning groove subjected to adhesive dispensing; and testing the finally packaged structure. The invention overcomes the defects of instability and the like of a nano waveguide and grating vertical coupling system on the existing optical integrated chip. The packaged structure provided by the invention has simple structure and high stability, resists external interference and is easy for array integration.

Description

technical field [0001] The invention belongs to the field of integrated optics, in particular to a packaging method for efficient vertical coupling and interconnection of an optical fiber and an optical waveguide chip. Background technique [0002] With the development of high-speed information technology, the development of integrated optical devices has become an inevitable trend in the interlaced development of various fields such as optical communication, optical computing, and optical sensing in the future. At the same time, it also has great potential application value in the fields of micro-optical devices, optical quantum devices, precision time-frequency measurement, optical integration, high-sensitivity sensors, optical networks, and optical quantum computers. The silicon-based integrated unit optical interconnection system is an interconnection system that uses light as the transmission signal and is composed of various silicon-based optical waveguide devices incl...

AI Technical Summary

Problems solved by technology

However, the use of vertical grating coupling has strict requirements on the incident angle of the fiber, and the stability of the coupling system is also very high, and repeatable operations cannot be achieved, requiring alignment every time

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