Integrated technology of solar dispensing

Abstract

The invention discloses an integrated technology of solar dispensing. The integrated technology comprises the following steps: selecting pieces, carrying out single welding and serial welding, arranging pieces, testing semi-finished products, baking the semi-finished products, carrying out vacuum pumping intermittently, secondarily dispensing, baking finished products, heating to bake, cooling and testing the finished products. By the technology disclosed by the invention, processing can be carried out on shells of all products directly; intermediate links of welding wires and bottom plates are omitted; accident rate is reduced; the practicability of the whole product is effectively improved; simultaneously, the appearance requirements of high-end digit products and electric toys with perfect interfaces can be met.

Description

technical field [0001] The invention relates to a solar energy glue-dropping integrated process, which is mainly applied in the field of electric toys and digital products. Background technique [0002] The traditional technology of solar glue board is to make solar silicon wafers use PCB or PET as the base plate, form glue board semi-products through glue technology, and then assemble them to achieve the purpose of charging the load, mainly through double-sided adhesive Stick or jam technology for assembly. [0003] In view of the fact that the bottom plate of the traditional solar epoxy board is easy to deform, the thickness is relatively thick, and the assembled product basically has obvious gaps, it is difficult to prevent dust and water, and the appearance is ugly. The packaging technology of solar silicon wafers and products has not broken through thin and light. The problem of integration and integration is mainly due to the difference in heat coefficients of solar e...

AI Technical Summary

Problems solved by technology

[0003] In view of the fact that the bottom plate of the traditional solar epoxy board is easy to deform, the thickness is relatively thick, and the assembled product basically has obvious gaps, it is difficult to prevent dust and water, and the appearance is ugly. The packaging technology of solar silicon wafers and products has not broken through thin and light. The problem of integration and integration is mainly due to the difference in heat coefficients of solar energy absorbed by silicon wafers, ABS resin and other substrate media. Once the product combination is integrated, whitening of the stretching gap is likely to occur, and severe fragments have no power, resulting in the overall hidden dangers of product quality

[0004] The current dispensing process is to put the entire dispensing product including the base plate in the depression of the shell, or it cannot be separated from the control of the base plate, and the glue is directly dripped onto the product. The product has a high scrap rate, and the main problems are whitening and glue overflow. The problem has not been resolved

Most of the solar glue shell mosaic technology is prone to fragmentation and whitening, mainly because the solar silicon chip absorbs the sun's heat coefficient and the heat coefficient of the shell coefficient is inconsistent, and the hardened glue is delaminated due to different expansion coefficients. White

In severe cases, the solar silicon wafer will be stretched, resulting in hidden cracks or fragments, which will reduce the power of the entire product, or even have no power