Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip
A technology of surface coating and fluorescent glue, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor spot quality and uneven thickness of fluorescent glue, and achieve uniform color, improved luminous flux and luminous efficiency, and uniform luminescence Effect
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Embodiment 1
[0055] figure 1 The implementation process of coating fluorescent glue on the surface of LED flip chip provided by the embodiment of the present invention is shown, and the details are as follows.
[0056] In step S101, the flip chip is fixed on the boss on the LED bracket;
[0057] In the embodiment of the present invention, the flip chip 25 is first fixed on the boss on the LED bracket 1, such as the flip chip 25 is eutectically welded to the LED bracket 1, and the flip chip 25 is connected to the bracket electrodes, as shown in FIG. Figure 2~4 shown. Wherein, the upper surface and four sides of the flip chip 25 all emit light.
[0058] It should be noted that the LED bracket 1 has a chip-bonding area where the flip chip 25 is fixed, and a groove is provided around the chip-bonding area, thereby forming a boss carrying fluorescent glue, or by the The groove directly regulates fluorescent glue, such as Figure 2-11 shown. Therefore, there is no need to set up additional...
Embodiment 2
[0078] Different from the previous embodiments, the LED bracket in this embodiment only has grooves separating the positive and negative electrode sheets, without bosses or grooves, saving the process of processing bosses or grooves, and improving efficiency . Figure 18 The implementation process of coating fluorescent glue on the surface of LED flip chip provided by the embodiment of the present invention is shown, and the details are as follows.
[0079] In step S1801, the flip chip is fixed on the LED bracket;
[0080] In the embodiment of the present invention, the flip-chip chip 25 is fixed on the die-bonding area on the LED bracket 1 first, such as the flip-chip chip 25 is eutectically welded to the LED bracket 1, and the flip-chip chip 25 is connected to the bracket electrodes, as shown in FIG. Figure 19 shown. Wherein, the upper surface and four side surfaces of the flip chip 25 all emit light.
[0081] In step S1802, dispensing fluorescent glue on the upper surfa...
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