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Manufacturing method of two-layer single-sided flexible copper clad laminate

A technology of flexible copper clad laminates and manufacturing methods, applied in lamination auxiliary operations, chemical instruments and methods, lamination, etc. Solve problems such as imide solubility, achieve excellent comprehensive performance, improve uniformity, and uniform performance

Active Publication Date: 2015-03-25
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The solvent used in this method is N-methylpyrrolidone. In order to increase the solubility of polyimide, the dimensional stability must be sacrificed.
And the patent does not involve the process of imidization
In addition, the solvent resistance of the two-layer flexible copper clad laminate produced by this method will decrease

Method used

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  • Manufacturing method of two-layer single-sided flexible copper clad laminate
  • Manufacturing method of two-layer single-sided flexible copper clad laminate
  • Manufacturing method of two-layer single-sided flexible copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0041] Weigh 6.5058g of 4,4'-ODA and 16.0058g of PPDA, dissolve them in 600g of m-CRESOL solvent while stirring in a 1000ml three-neck flask at a temperature of 25°C, and then add 52.3712g of S-BPDA was continuously stirred for 4 hours to carry out polymerization reaction to obtain a polyamic acid solution. 37.91 g of TFAA and 18.23 g of TEA were added to the polyamic acid solution, the temperature was raised to 35° C., and the reaction was refluxed for 3 hours to obtain an isomerized polyimide solution.

Synthetic example 2

[0043] Weigh 6.5058g of 4,4'-ODA and 43.2678g of TPE-Q, and dissolve them in 600g of m-CRESOL solvent while stirring in a 1000ml three-necked flask with a temperature of 25°C. Under the condition of nitrogen gas and stirring, Add 52.3712g of S-BPDA, continue to stir for 4 hours, carry out polymerization reaction, and prepare polyamic acid solution. 37.91 g of TFAA and 18.23 g of TEA were added to the polyamic acid solution, the temperature was raised to 35° C., and the reaction was refluxed for 3 hours to obtain an isomerized polyimide solution.

Synthetic example 3

[0045] Weigh 6.5058g of 4,4'-ODA and 16.0058g of PPDA, dissolve them in 600g of m-CRESOL solvent while stirring in a 1000ml three-neck flask at a temperature of 25°C, and then add 52.3712g of S-BPDA was continuously stirred for 4 hours to carry out polymerization reaction to obtain a polyamic acid solution. Add 18.411g AC to this polyamic acid solution 2 O and 18.23g TEA, heated up to 35°C, refluxed for imidization reaction, due to the use of AC 2 O, as a dehydrating agent, cannot obtain isomerized polyimide, the solubility is not good, gelation occurs, and a polyimide solution cannot be obtained.

[0046] The polyimide solution applied to the present invention is not limited to the polyimide solution in the above synthesis example, as long as it is a heterogeneous polyimide with solvent solubility and high temperature non-melting property, it is suitable for the present invention production method. The solvent used in the above synthesis examples is not particularly limite...

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Abstract

The invention relates to a manufacturing method of a two-layer single-sided flexible copper clad laminate, which comprises the following steps: synthesizing an isomeric polyimide liquid, wherein the isomeric polyimide has imide rings with a structure as formula (1); coating the isomeric polyimide liquid on a cooper foil for being subjected to baking at a temperature of 200-250 DEG C to completely remove the solvent; rolling to be in a roll shape with a length of 100-1500m / roll; and putting the roll shape copper foil in a high-temperature nitrogen roaster and performing hot isomerization at a temperature of 250-350 DEG C to obtain the two-layer single-sided flexible copper clad laminate. According to the manufacturing method of the two-layer single-sided flexible copper clad laminate provided by the invention, the synthesized isomeric polyimide liquid, which is soluble in solvents but can not be molten under high temperature, is coated on the copper foil, the copper foil rolls to be in the roll shape after the solvent is completely removed, and then is manufactured to the two-layer single-sided flexible copper clad laminate after being subjected to the hot isomerization without being roll lossened, so that the productive efficiency is greatly improved, and the uniformity of the product performance is promoted. The two-layer single-sided flexible copper clad laminate produced with the method has good integrated performance and uniform performance.

Description

technical field [0001] The invention relates to the field of flexible printed circuit boards, in particular to a method for manufacturing a two-layer single-sided flexible copper-clad laminate that can greatly improve production efficiency. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants and digital cameras. Due to the continuous improvement of technical requirements in the electronics industry, consumer electronics products are rapidly becoming thinner and smaller The corresponding flexible copper clad laminates are required to be lighter and thinner and have high heat resistance and high reliability. The two-layer flexible copper clad laminate has achieved rapid development in recent years due to the use of polyimide resin with excellent mechanical properties, electrical properties and heat resistance. [0003] The manufacturing metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20B32B37/15B32B38/16
Inventor 梁立茹敬宏张翔宇
Owner GUANGDONG SHENGYI SCI TECH