Design and implementation method for miniaturization, high reliability and electro magnetic compatibility (EMC) of high-output-power transmitter/receiver (T/R) component
A technology with high output power and a realization method, which is applied in the direction of electrical components, waveguide devices, instruments, etc., can solve the problems of unsatisfactory EMC performance, large volume and weight, etc., achieve simple circuit form, improve space isolation, and reliability Enhanced performance and miniaturization
Inactive Publication Date: 2012-07-11
THE 724TH RES INST OF CHINA SHIPBUILDING IND
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Problems solved by technology
[0004] In order to solve the problem that the traditional high output power T / R module is too large and heavy, and the EMC performance is not ideal, the present invention uses a "sandwich" type double-sided microwave circuit to form two similar structures with multiple cavities The metal shell buckles the whole multi-layer microwave circuit substrate in the middle. The pre-designed gold-plated strip-shaped ground plane on the surface of the circuit substrate and the corresponding structural ribs of the component shell form a closed cavity after contacting each functional circuit module. Completely separated in space, which can improve the space isolation and improve the EMC performance of components
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[0008] 1. Lamination process of multilayer microwave circuit substrate
[0009] A 6-layer PCB microwave circuit substrate is produced by high-temperature lamination of multiple resin-type double-sided copper-clad laminates filled with ceramic powder and corresponding prepregs, and then metallized via holes and mechanical edge trimming.
[0010] 2. Electromagnetic simulation and PCBLayout design of multilayer microwave circuits
[0011] Use the 3D electromagnetic simulation software to carry out the simulation design of the radio frequency circuit of the built-in radio frequency ground plane multilayer board and carry out the PCBLayout design according to the simulation results.
[0012] 3. Design and manufacture of component metal structure shell
[0013] According to the PCBLayout design data, import the 3D structure design software to design the component shell structure and select the appropriate profile to complete the machining and the corresponding surface treatment pro...
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The invention discloses a design and implementation method for miniaturization and electro magnetic compatibility (EMC) of a high-output-power transmitter / receiver (T / R) component of an active phased array radar and aims to solve the problems of large volume, heavy weight, low EMC performance and low reliability of the conventional high-output-power T / R component. In a sandwiched double-faced microwave circuit forming mode, two similar metal shells with a plurality of cavity structures buckle a middle integrated multi-layer microwave circuit base plate up and down, wherein devices can be densely assembled on double faces of the multi-layer microwave circuit base plate; and a gold-coated strip-shaped grounding plane on the surface of the circuit base plate is contacted with corresponding component shell structure ribs to form a closed cavity for spatially isolating all functional circuit modules completely, so the volume and weight of the high-output-power T / R component can be effectively reduced, and the reliability and the EMC performance can be improved. The method provided by the invention can be directly applied to design of the high-output-power T / R component of the active phased array radar, can be applied to design of relevant microwave functional modules, and has the characteristics of simple circuit form, easiness in assembly, high reliability and the like.
Description
technical field [0001] The invention relates to a miniaturization, high reliability and EMC design realization method of a high output power T / R assembly. By adopting a new type of "sandwich" type double-sided microwave circuit structure, two similar metal shells with multiple cavity structures are buckled up and down to a multi-layer microwave circuit with a whole double-sided high-density assembled device in the middle The substrate, the gold-plated strip-shaped ground plane on the surface of the circuit substrate and the corresponding structural ribs of the component shell form a closed cavity to completely separate each functional circuit module in space, thereby reducing the cost of high output power T / R components. The volume weight improves EMC performance and reliability, and belongs to the technical field of radio frequency microwave circuits. Background technique [0002] At present, active phased array has become the mainstream in the development of phased array ...
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IPC IPC(8): G01S7/02H01P1/208
Inventor 吴苏兴耿亮
Owner THE 724TH RES INST OF CHINA SHIPBUILDING IND