Method for enlarging bonding area of chip
A chip bonding and area technology, applied in the direction of sustainable manufacturing/processing, electrical components, climate sustainability, etc., can solve problems such as poor appearance, grain loss, and increased manufacturing costs, so as to save chemicals and equipment use The effect of reducing the abnormal occurrence of bonded layer shedding, and the operation of the equipment is simple and convenient
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[0016] The present invention can adopt following implementation method to realize:
[0017] (1) the wafer is cleaned;
[0018] (2) Put the vapor deposition target in the coating machine, then place the wafer in the vertical plating pot, and put the plating pot into the coating machine;
[0019] (3) Vacuuming 4.5×10 -4 Pa, began to evaporate.
[0020] (4) After the evaporation is completed, the wafer is removed from the positive plating pot for bonding.
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