Three-dimensional system-in-package package-on-package structure

Abstract

The present invention provides a three-dimensional System-In-Package (SIP) Package-On-Package (POP) structure comprising a support element formed around a first electronic device. A filling material is filled between the first electronic device and the support element. Signal channels are coupled to first die pads of the first electronic device. Conductive elements form signal connection between the first end of the signal channels and the second die pads of a second electronic device.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a three-dimensional system-in-package stacking packaging structure. Background technique [0002] In the field of semiconductor devices, device density continues to increase and device size continues to decrease. Therefore, such high-density packaging technology and interconnection technology are also improved to apply the above-mentioned conditions. In the traditional flip-chip structure, the array of solder balls is formed on the surface of the die, and the desired pattern is formed through the traditional solder paste and the solder ball mask. Chip packaging functions include heat dissipation, signal transmission, power distribution, protection, etc. When the chip is more complex, traditional packaging such as lead frame packaging, flexible packaging, and rigid packaging technology cannot meet the needs of high-density and small-size chips. [0003] Furthermore, semiconductor compone...

AI Technical Summary

Problems solved by technology

Unfortunately, leadframe-based 3D packaging appears to be insufficient in its ability to handle the increasing circuit density demands of high-level functionally integrated systems

In general, lead frame packaging has its limitations due to factors such as increased package thickness, larger package area, and insufficient I / O leads to handle higher circuit densities

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