Nitrogen gas injection apparatus

Abstract

The present invention relates to a nitrogen gas injection apparatus for semiconductor fabrication equipment of LCD fabrication equipment, which can be simply manufactured and which thus reduces manufacturing costs, and which enables a nitrogen gas injection direction to correspond to the flow direction of reaction by-products, to thereby inject nitrogen gas in an effective manner without disturbing the flow of reaction by-products. The nitrogen gas injection apparatus comprises: a pair of flanged pipes having flanges; a ring-shaped injection nozzle coupled along the inner wall of one of the flanged pipes coupled together, to supply nitrogen gas into the flanged pipes; and a nitrogen supply line connected to the injection nozzle to supply nitrogen gas.; The interior of the injection nozzle has a hole to enable the nitrogen gas supplied in a circumferential direction to flow, and a plurality of injection holes communicating with the hole to inject the supplied nitrogen gas into the flanged pipes. The injection holes are formed at the position protruding from the inner surface of one of the flanged pipes to inject nitrogen gas in the flow direction of reaction by-products.

Description

technical field [0001] The present invention relates to a semiconductor device and LCD manufacturing equipment, and more particularly, to a nitrogen gas injection device which can be easily manufactured with low production cost, and controls a nitrogen gas injection direction to coincide with a by-product flow direction, so that it can be efficiently injected Nitrogen without interfering with the flow of by-product gases. Background technique [0002] Generally, a semiconductor production process includes a manufacturing process and an assembly and testing process. The manufacturing process is the process of manufacturing semiconductors by depositing thin films on a wafer in various processing chambers and selectively and repeatedly etching the deposited films to form a predetermined pattern. The assembly and test process is a process of separating the chips produced in the manufacturing process individually, and then coupling the individual chips to a lead frame so as to b...

AI Technical Summary

Problems solved by technology

Therefore, the process of manufacturing the conventional nitrogen supply device becomes complicated, which increases the production cost

In addition, it is not easy to form a plurality of fine injection holes 22 on the thick body 21 of the flange tube 2, so it is difficult to inject nitrogen uniformly.

[0011] In addition, conventional nitrogen supply devices cannot easily finely control the injection of nitrogen gas, so it is difficult to install the device on the exit side of the vacuum tube of the process chamber

In this case, if an electronic flow control device can be used to control the amount of nitrogen supplied, the product price will inevitably increase

[0012] In addition, the flow of by-product gas is disturbed by the injection of nitrogen

Therefore, it is difficult to install the device on the outlet side of the vacuum line of the process chamber, which is sensitive to pressure changes

Also, since the injection hole 22 is blocked by the by-product gas, it is difficult to inject nitrogen uniformly

Images