Lead frame
A lead frame and lead technology, which is applied in the field of semiconductor packaging, can solve the problems of restricting the large-scale production of products, the yield cannot be improved, and the frame production efficiency is low, so as to improve the utilization rate, improve the packaging yield, and avoid resistance. effect of material phenomenon
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[0019] The present invention will be further specifically described below in conjunction with the accompanying drawings.
[0020] refer to image 3 , a lead frame, the connecting portion of the carrier 4 of the lead frame 1 is designed with a stress relief groove 5 .
[0021] A runner groove 7 is designed in the area of the connecting rods in the same row in the lead frame 1 .
[0022] image 3 Middle: 2 is the fine positioning hole; 3 is the pin; 6 is the middle rib; 8 is the combined positioning hole and it is waist-shaped.
[0023] The lead frame 1 is designed to have two to eight rows, and can be stamped into a double-row or 4-row or 6-row or 8-row frame.
[0024] The I / O pins of the lead frame 1 are designed with 3 or 4 or 5 pins, which expands the scope of use of the frame.
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Abstract
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