Lead frame

A lead frame and lead technology, which is applied in the field of semiconductor packaging, can solve the problems of restricting the large-scale production of products, the yield cannot be improved, and the frame production efficiency is low, so as to improve the utilization rate, improve the packaging yield, and avoid resistance. effect of material phenomenon

Inactive Publication Date: 2012-07-18
TIANSHUI HUATIAN MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing IPAK / TO-251 power devices at home and abroad, they are all packaged with single-row lead frame. This kind of frame has low production efficiency, large consumption of raw materials, easy deformation of the frame, low yield rate, and difficult reliability. Grasp and other factors seriously restrict the large-scale production of such products
[0005] It has been verified that there is no IPAK / TO-251 lead frame with stress relief grooves in the industry at home and abroad.

Method used

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Embodiment Construction

[0019] The present invention will be further specifically described below in conjunction with the accompanying drawings.

[0020] refer to image 3 , a lead frame, the connecting portion of the carrier 4 of the lead frame 1 is designed with a stress relief groove 5 .

[0021] A runner groove 7 is designed in the area of ​​the connecting rods in the same row in the lead frame 1 .

[0022] image 3 Middle: 2 is the fine positioning hole; 3 is the pin; 6 is the middle rib; 8 is the combined positioning hole and it is waist-shaped.

[0023] The lead frame 1 is designed to have two to eight rows, and can be stamped into a double-row or 4-row or 6-row or 8-row frame.

[0024] The I / O pins of the lead frame 1 are designed with 3 or 4 or 5 pins, which expands the scope of use of the frame.

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Abstract

The invention relates to the technical field of semiconductor package, in particular to an IPAK / TO-251 lead frame. A connecting part of two rows (or four rows, or six rows, or eight rows) of carriers of the frame is provided with a stress release groove; and a flushing runner groove is formed in a connecting rod area in the same column. The lead frame has the basic functions of preventing leakage, water, tripping and reversion, precisely positioning and the like, and stress generated be the deformation of the lead frame in a punching or packaging process can be released in a concentrating way, so delamination caused after a plastic packaging body and the lead frame are stressed by an internal stress is prevented, and the reliability of a product is ensured; the problem that materials are difficult to unload from a plurality of pouring passages is also solved at the same time, and blockage of the product in the next track conveying process is avoided; and the production efficiency is improved, and the packaging yield is also improved at the same time.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an IPAK / TO-251 lead frame. Background technique [0002] Lead frame (Lead Frame) is the carrier of the chip. After wire bonding, it plays the role of transmitting the internal circuit of the chip and the external electrical signal. It plays the role of positioning and mechanical support in the packaging process and installation process; and the role of heat conduction during operation. Therefore, the lead frame is an important component in the field of power device packaging. [0003] With the continuous expansion of demand for power devices in the consumer market in recent years, the continuous improvement of product reliability requirements has brought development opportunities to the power device packaging industry, and at the same time it has also posed new challenges to the power device packaging industry. Therefore, whether the design of the lead frame used...

Claims

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Application Information

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IPC IPC(8): H01L23/495
CPCH01L2924/0002H01L2924/00
Inventor 崔卫兵
Owner TIANSHUI HUATIAN MICROELECTRONICS
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