High-power high-brightness light-emitting diode (LED) light source packaging structure and packaging method thereof

Abstract

The invention discloses a high-power high-brightness light-emitting diode (LED) light source packaging structure and a packaging method thereof. The packaging structure provided by the invention comprises a radiation board, a circuit board and an LED module, wherein the LED module is manufactured by performing contact-type radiation treatment, thermal stress reduction treatment and insulation treatment on an LED chip; the LED module is welded on the radiation board; and the circuit board is welded or adhered to the radiation board, so that the circuit board is distributed on the periphery of the LED module and is electrically connected with the LED chip. According to the invention, through the optimal design of the LED light source packaging structure, the problems of low radiation efficiency and poor stability of the LED packaging structure in the prior art can be solved, the problem that the LED chip is mismatched with a heat sink thermal expansion coefficient is solved, and the packaging structure has the advantages of high stability, long storage life, low cost and the like.

Description

technical field [0001] The invention belongs to the technical field of LED light sources and relates to packaging of LED light sources, in particular to a high-power and high-brightness LED light source packaging structure and a packaging method thereof. Background technique [0002] Light sources commonly used in projection display systems are ultra-high pressure mercury lamps (UHP), metal halide lamps, xenon lamps, and halogen lamps. Human beings have been looking for and developing solid-state light sources for many years. With the development of light-emitting materials and the improvement of semiconductor manufacturing processes, the efficiency of light-emitting diodes for semiconductor lighting has continued to increase. At present, the ultra-high pressure mercury lamp is the mainstream light source of the projection device. Light-emitting diodes (LEDs for short) are a type of semiconductor device that directly converts electrical energy into light energy. LED has a ...

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Problems solved by technology

[0013] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, and provide a high-power and high-brightness LED light source packaging method and packaging structure. The present invention can solve the problem of heat dissipation of the LED packaging structure in the prior art by optimizing the design of the LED light source packaging structure. The problem of low efficiency and poor stability can be improved, and the problem of thermal expansion coefficient mismatch between the LED chip and the heat sink can be improved

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