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Electronic component mounting means

An electronic component installation and electronic component technology, applied in the direction of electrical components, electric solid state devices, semiconductor/solid state device components, etc., can solve problems such as electronic component breakage, and achieve the effect of high productivity

Inactive Publication Date: 2012-07-25
POLYPLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the sealing resin is molded with a thermoplastic resin, shrinkage stress tends to concentrate on the electronic parts due to curing shrinkage of the sealing resin.
When shrinkage stress concentrates on electronic parts, it may cause adverse effects such as damage to electronic parts

Method used

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  • Electronic component mounting means
  • Electronic component mounting means
  • Electronic component mounting means

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] The ferrule terminal is placed in a cavity with a cylindrical protruding pin on the back, and the upper surface is approximately spherical in diameter with a diameter of 7mm. A material containing 3% by mass of a foaming agent is added to low melting point PBT under the following conditions Injection molding. The electronic component mounting part of Example 1 was obtained as follows.

[0101] (molding conditions)

[0102] Mold temperature: 60°C

[0103] Molding machine barrel temperature: 260°C

[0104] Holding pressure: 10 seconds under 50MPa

[0105] As a result of visually confirming the appearance of the electronic component mounting component of Example 1, no dents were found. From this, it can be confirmed that the bubbles of the foamed thermoplastic resin are hardly destroyed during curing shrinkage of the thermoplastic resin during molding.

[0106] When this electronic component mounting member was cut in the longitudinal direction, and the cross-section ...

Embodiment 2

[0109] After changing the condition of the holding pressure to the condition of carrying out the holding pressure for 3 seconds at 50 MPa and then carrying out the holding pressure for 7 seconds at 10 MPa, except that, the electronic component package of Example 2 was manufactured in the same manner as in Example 1. part.

[0110] As a result of visually confirming the appearance of the electronic component mounting component of Example 2, similar to Example 1, no dents were recognized. When this electronic component mounting member was cut in the longitudinal direction and the cross-section was observed, an extremely large air bubble group was found in the central portion where the hoop terminal was provided. The airtightness of the interface between the ferrule terminal and the foamed thermoplastic resin was determined by an ink immersion test. There was almost no ink penetration, and it was confirmed that there was no problem.

Embodiment 3

[0112] The electronic component mounting part of Example 3 was manufactured in the same manner as in Example 1 except that the cavity was changed to an ellipse-shaped cavity in which the major axis was twice the minor axis. When this electronic component mounting member was cut in the longitudinal direction and the cross-section was observed, bubbles were confirmed to the extent that the shrinkage stress applied to the ferrule terminal due to the shrinkage of the foamed thermoplastic resin during curing was sufficiently relieved. It should be noted that "bubbles to the extent that the shrinkage stress applied to the ferrule terminal can be sufficiently relieved" means that in the case of an ellipsoidal shape, compared with the case of a spherical shape, the air bubbles are formed due to shrinkage during curing of the foamed thermoplastic resin. The foamed thermoplastic resin is easily deformed, but even considering the easiness of deformation, it is possible to sufficiently rel...

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PUM

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Abstract

The present invention provides an electronic component mounting means, wherein thermoplastic resin is adopted to improve the productivity of electronic components sealed by resin. Meanwhile, problems caused by the curing shrinkage of the sealing resin due to the adoption of the thermoplastic resin are avoided. Foaming thermoplastic resin is adopted as resin sealing material, while the peripheral shape of the cross section of a sealing resin part vertical to a substrate is circular arc-shaped. The circular arc shape is preferably and substantially circular arc shape. In addition, the surface of the sealing resin part is preferably and generally a spherical surface. The foaming thermoplastic resin preferably comprises polyytrimethylene diformic butanedio ester resin as the main component thereof, which is low in melting point and high in mobility.

Description

technical field [0001] The present invention relates to electronic component mounting components. Background technique [0002] As a sealing technology for protecting electronic components such as ICs, capacitors, and diodes in a mechanical and electrical external environment, resin sealing that is inexpensive and excellent in mass productivity is known. [0003] As a method of this resin sealing, the following method is known: first, a semiconductor element etc. mounted on a base material is placed in a mold, then, a resin for sealing is melted and injected into the mold, and finally, the resin is solidified, Then unmold. [0004] Thermosetting resins such as phenolic resins, epoxy resins, and silicone resins are used as resins for sealing electronic components such as ICs (for example, refer to Patent Document 1). These thermosetting resins are excellent in adhesion to ceramics and metals, and are also excellent in heat resistance and chemical resistance. Therefore, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/29H01L21/56B29C45/77B29C45/14
CPCH01L2924/1815
Inventor 望月章弘
Owner POLYPLASTICS CO LTD